A scanning wafer thickness and flatness interferometer

M.J. Jansen, H. Haitjema, P.H.J. Schellekens

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

23 Citations (Scopus)
356 Downloads (Pure)

Abstract

Since the wafer industry in using an increasing amount of double side polished wafers, the future of wafer metrology is very likely to shift from capacitance gauging techniques to optical measurement techniques. Participating in an international project the Technical University of Eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device.By using proper measurement principles and advanced software a robust traceble wafer thickness measurement instrument is created which combines high lateral resolution, nanometer accuracy, high speed and low cost. The data analysis used in this scanning interferometer involves multiple phase extraction methods, newly developed robust unwrapping methods, surface stitching and smart measuring strategies for the application of software compensation techniques.
Original languageEnglish
Title of host publicationOptical fabrication, testing, and metrology : 30 September - 3 October 2003, St. Etienne, France
EditorsR. Geyl, D. Rimmer, L. Wang
Place of PublicationBellingham
PublisherSPIE
Pages334-345
DOIs
Publication statusPublished - 2003

Publication series

NameProceedings of SPIE
Volume5252
ISSN (Print)0277-786X

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