@inproceedings{d440a1c4e5704fe4b6c6bb58f29affe4,
title = "A scanning wafer thickness and flatness interferometer",
abstract = "Since the wafer industry in using an increasing amount of double side polished wafers, the future of wafer metrology is very likely to shift from capacitance gauging techniques to optical measurement techniques. Participating in an international project the Technical University of Eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device.By using proper measurement principles and advanced software a robust traceble wafer thickness measurement instrument is created which combines high lateral resolution, nanometer accuracy, high speed and low cost. The data analysis used in this scanning interferometer involves multiple phase extraction methods, newly developed robust unwrapping methods, surface stitching and smart measuring strategies for the application of software compensation techniques.",
author = "M.J. Jansen and H. Haitjema and P.H.J. Schellekens",
year = "2003",
doi = "10.1117/12.515650",
language = "English",
series = "Proceedings of SPIE",
publisher = "SPIE",
pages = "334--345",
editor = "R. Geyl and D. Rimmer and L. Wang",
booktitle = "Optical fabrication, testing, and metrology : 30 September - 3 October 2003, St. Etienne, France",
address = "United States",
}