A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.

LanguageEnglish
Title of host publication43rd European Conference on Optical Communication, ECOC 2017
PublisherInstitute of Electrical and Electronics Engineers
Number of pages3
Volume2017-September
ISBN (Electronic)978-1-5386-5624-2
DOIs
StatePublished - 24 Apr 2018
Event43rd European Conference on Optical Communications (ECOC 2017) - Gothenburg, Sweden
Duration: 17 Sep 201721 Sep 2017
Conference number: 43
http://ecoc2017.org/
http://ecoc2017.org

Conference

Conference43rd European Conference on Optical Communications (ECOC 2017)
Abbreviated titleECOC 2017
CountrySweden
CityGothenburg
Period17/09/1721/09/17
OtherThe largest conference on optical communication in Europe and
one of the largest and most prestigious events in this field worldwide.
Held in Gothenburg, Sweden 17-21 September 2017.
Internet address

Fingerprint

Optical interconnects
Surface emitting lasers
Silicon

Cite this

Li, C., Li, T., Stabile, R., & Raz, O. (2018). A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September). [8345902] Institute of Electrical and Electronics Engineers. DOI: 10.1109/ECOC.2017.8345902
Li, Chenhui ; Li, Teng ; Stabile, Ripalta ; Raz, Oded. / A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018.
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abstract = "We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.",
author = "Chenhui Li and Teng Li and Ripalta Stabile and Oded Raz",
year = "2018",
month = "4",
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doi = "10.1109/ECOC.2017.8345902",
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Li, C, Li, T, Stabile, R & Raz, O 2018, A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, 8345902, Institute of Electrical and Electronics Engineers, 43rd European Conference on Optical Communications (ECOC 2017), Gothenburg, Sweden, 17/09/17. DOI: 10.1109/ECOC.2017.8345902

A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. / Li, Chenhui; Li, Teng; Stabile, Ripalta; Raz, Oded.

43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018. 8345902.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Li C, Li T, Stabile R, Raz O. A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September. Institute of Electrical and Electronics Engineers. 2018. 8345902. Available from, DOI: 10.1109/ECOC.2017.8345902