Abstract
We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.
Original language | English |
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Title of host publication | 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 318-321 |
Number of pages | 4 |
ISBN (Electronic) | 9781538647820 |
DOIs | |
Publication status | Published - 24 Apr 2018 |
Event | 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2018) - Belfast, United Kingdom Duration: 21 Jan 2018 → 25 Jan 2018 |
Conference
Conference | 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2018) |
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Abbreviated title | MEMS2018 |
Country/Territory | United Kingdom |
City | Belfast |
Period | 21/01/18 → 25/01/18 |
Funding
The authors gratefully acknowledge the technical support and advice of the staff at the Else Kooi Lab, MIRA and BME laboratories at TU/e. This work was a pilot project under the framework of the NanoInside: Organs-on-Chips Technology Platform, a subsidy promoted by hDMT and granted by NanoNextNL. William F. Quirós-Solano is partially financed by Instituto Tecnológico de Costa Rica. Nikolas Gaio is financed by Electronic Components and Systems for European Leadership (ECSEL) “InForMed” (No.2014-2-662155).