A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

W.F. Quiros-Solano, N. Gaio, C. Silvestri, Y.B. Arik, O.M.J.A. Stassen, A.D. van der Meer, C.V.C. Bouten, A. van den Berg, R. Dekker, P.M. Sarro

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Abstract

We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.

Original languageEnglish
Title of host publication2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages318-321
Number of pages4
ISBN (Electronic)9781538647820
DOIs
Publication statusPublished - 24 Apr 2018
Event31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2018) - Belfast, United Kingdom
Duration: 21 Jan 201825 Jan 2018

Conference

Conference31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2018)
Abbreviated titleMEMS2018
CountryUnited Kingdom
CityBelfast
Period21/01/1825/01/18

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Quiros-Solano, W. F., Gaio, N., Silvestri, C., Arik, Y. B., Stassen, O. M. J. A., van der Meer, A. D., ... Sarro, P. M. (2018). A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018 (pp. 318-321). Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/MEMSYS.2018.8346550