A novel frequency domain maximum likelihood approach for estimating transport coefficients in cylindrical geometry for nuclear fusion devices

Matthijs van Berkel, Gerardus W. Oosterwegel, Martijn Anthonissen, Hans J. Zwart, Gerd Vandersteen

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Abstract

This paper introduces a novel maximum likelihood approach to determine the local thermal transport coefficients belonging to diffusion and convection from excitation (perturbative) transport experiments. It extends previous work developed for linear (slab) geometry to cylindrical (toroidal) geometry for fusion reactors. The previous linear geometry approach is based on analytic solutions of the partial differential equation. However, for cylindrical geometries with convection the analytic solutions are confluent hypergeometric functions (CHFs) with complex valued arguments. Most numerical libraries do not support CHFs evaluation with complex valued arguments. Hence, this paper proposes the use of an ultra-fast transfer function evaluation based on sparse numerical solutions for the discretized partial differential equation. This solution is implemented in MATLAB

Original languageEnglish
Title of host publication2019 IEEE 58th Conference on Decision and Control, CDC 2019
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages3220-3226
Number of pages7
ISBN (Electronic)9781728113982
DOIs
Publication statusPublished - Dec 2019
Event58th IEEE Conference on Decision and Control, CDC 2019 - Nice, France
Duration: 11 Dec 201913 Dec 2019

Conference

Conference58th IEEE Conference on Decision and Control, CDC 2019
CountryFrance
CityNice
Period11/12/1913/12/19

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  • Cite this

    van Berkel, M., Oosterwegel, G. W., Anthonissen, M., Zwart, H. J., & Vandersteen, G. (2019). A novel frequency domain maximum likelihood approach for estimating transport coefficients in cylindrical geometry for nuclear fusion devices. In 2019 IEEE 58th Conference on Decision and Control, CDC 2019 (pp. 3220-3226). [9029992] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/CDC40024.2019.9029992