A novel 3D stacking method for opto-electronic dies on CMOS ICs

P. Duan, O. Raz, B.E. Smalbrugge, J. Duis, H.J.S. Dorren

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Abstract

High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch.

Original languageEnglish
Title of host publicationProceedings of the 38th European Conference on Optical Communication (ECOC 2012), 16 - 20 September 2012, Amsterdam, The Netherlands
PublisherOptical Society of America (OSA)
PagesTu.3.E.2-1/3
ISBN (Print)9781557529503
DOIs
Publication statusPublished - 1 Dec 2012
Event38th European Conference and Exhibition on Optical Communication (ECOC 2012) - Amsterdam, Netherlands
Duration: 16 Sep 201220 Sep 2012
Conference number: 38

Conference

Conference38th European Conference and Exhibition on Optical Communication (ECOC 2012)
Abbreviated titleECOC 2012
CountryNetherlands
CityAmsterdam
Period16/09/1220/09/12
Other38th European Conference on Optical Communication (ECOC)

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