A novel 3D stacking method for opto-electronic dies on CMOS ICs

P. Duan, O. Raz, B. Smalbrugge, J. Duis, H.J.S. Dorren

Research output: Contribution to journalArticleAcademicpeer-review

13 Citations (Scopus)
372 Downloads (Pure)

Abstract

A high speed, high density and potentially low cost solution for realizing a compact transceiver module is presented in this paper. It is based on directly bonding an Opto-electronic die on top of CMOS IC chip and creating a photoresist ramp to bridge the big step (around 220µm) from Opto-electronic pads to CMOS IC pads. The required electrical connection between them is realized lithographically with a process than can be scaled to full wafer production. A 12-channel transmitter based on the technique was fabricated and test shows good performance up to 12.5 Gb/s/ch.
Original languageEnglish
Pages (from-to)B386-B392
JournalOptics Express
Volume20
Issue number26
DOIs
Publication statusPublished - 2012

Fingerprint Dive into the research topics of 'A novel 3D stacking method for opto-electronic dies on CMOS ICs'. Together they form a unique fingerprint.

Cite this