Compact integrated receiver modules are key building blocks for high bandwidth density interconnection links. Previously, a 3D stacked receiver module was fabricated by utilizing an ultra-thick photo resist ramp to form a wafer level package strategy. In this paper, we will demonstrate another integrated approach based on the same technology. Instead of stacking the photodiode array on the TIA/LA chip, we placed them side-by-side on a silicon carrier in very close proximity. The metallic connections between the photodiode pads and TM/LA pads were realized using electrical plating after a photo resist bridge is created between the two components. Visual inspection using a SEM show that connecting metal stripes are uniform and ofgood quality.
|Title of host publication||Proceedings of the 18th Annual Symposium of the IEEE Photonics Benelux Chapter, 25-26 November 2013, Technische Universiteit Eindhoven|
|Editors||X.J.M. Leijtens, D. Pustakhod|
|Place of Publication||Eindhoven|
|Publisher||Eindhoven University of Technology|
|Publication status||Published - 2013|