A new zero-level package approach for receiver modules

P. Duan, O. Raz, B. Smalbrugge, H.J.S. Dorren

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Abstract

Compact integrated receiver modules are key building blocks for high bandwidth density interconnection links. Previously, a 3D stacked receiver module was fabricated by utilizing an ultra-thick photo resist ramp to form a wafer level package strategy. In this paper, we will demonstrate another integrated approach based on the same technology. Instead of stacking the photodiode array on the TIA/LA chip, we placed them side-by-side on a silicon carrier in very close proximity. The metallic connections between the photodiode pads and TM/LA pads were realized using electrical plating after a photo resist bridge is created between the two components. Visual inspection using a SEM show that connecting metal stripes are uniform and ofgood quality.
Original languageEnglish
Title of host publicationProceedings of the 18th Annual Symposium of the IEEE Photonics Benelux Chapter, 25-26 November 2013, Technische Universiteit Eindhoven
EditorsX.J.M. Leijtens, D. Pustakhod
Place of PublicationEindhoven
PublisherEindhoven University of Technology
Pages199-202
ISBN (Print)978-90-386-3512-5
Publication statusPublished - 2013

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