A new technique for accurately defined deposition of catalyst thin films in deep flow channels of high-temperature gas microreactors

R.M. Tiggelaar, J.W. Berenschot, R.E. Oosterbroek, P. Male, van, M.H.J.M. Croon, de, J.C. Schouten, A. Berg, van den, M.C. Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)

Abstract

By using microreactors fabricated with silicon microtechnology, heterogeneous catalyzed gas-phase reactions can be studied which are difficult to control because of their exothermic nature, are explosive or use toxic/hazardous gases. In this type of microreactors, catalytic materials like rhodium or platinum are deposited on a thin membrane in deep trenches. Conventional techniques, like lift-off lithography, cannot be used in deep trenches and deposition through flat shadow masks does not yield well-defined regions of catalyst. For well-controlled deposition of a catalytic thin film on a membrane located in a deep trench, a technique is developed using sputter deposition with a 3-dimensionally shaped 'self-aligning' shadow mask.
Original languageEnglish
Title of host publicationProceedings of the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2003), 8-12 June 2003, Boston, United States
EditorsG.B. Hocker, R.T. Howe
Place of PublicationBoston (MA), United States
Pages746-749
DOIs
Publication statusPublished - 2003

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