A new package for silicon biosensors

A.J.M. Nellissen; J.W. Weekamp; J.A. van Delft; W. Ansems; Esther Janssen; M.W.J. Prins; M. Megens; R. Wimberger-Friedl; A.W.M. Iersel, van

A new package for silicon biosensors

A.J.M. Nellissen, J.W. Weekamp, J.A. van Delft, W. Ansems, Esther Janssen, M.W.J. Prins, M. Megens, R. Wimberger-Friedl, A.W.M. Iersel, van

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Citations (Scopus)

1 Downloads (Pure)

Abstract

A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions.

Original language	English
Title of host publication	Proceedings of the15th European Microelectronics and Packaging Conference (IMAPS & EMPC 15), June 12-15, 2005, Brugge, Belgium
Place of Publication	Brugge
Pages	201-204
Publication status	Published - 2005

Cite this

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title = "A new package for silicon biosensors",

abstract = "A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions.",

author = "A.J.M. Nellissen and J.W. Weekamp and \{van Delft\}, J.A. and W. Ansems and Esther Janssen and M.W.J. Prins and M. Megens and R. Wimberger-Friedl and \{Iersel, van\}, A.W.M.",

year = "2005",

language = "English",

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booktitle = "Proceedings of the15th European Microelectronics and Packaging Conference (IMAPS \& EMPC 15), June 12-15, 2005, Brugge, Belgium",

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T1 - A new package for silicon biosensors

AU - Nellissen, A.J.M.

AU - Weekamp, J.W.

AU - van Delft, J.A.

AU - Ansems, W.

AU - Janssen, Esther

AU - Prins, M.W.J.

AU - Megens, M.

AU - Wimberger-Friedl, R.

AU - Iersel, van, A.W.M.

PY - 2005

Y1 - 2005

N2 - A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions.

AB - A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions.

M3 - Conference contribution

SP - 201

EP - 204

BT - Proceedings of the15th European Microelectronics and Packaging Conference (IMAPS & EMPC 15), June 12-15, 2005, Brugge, Belgium

CY - Brugge

ER -

A new package for silicon biosensors

Abstract

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