A new concept for spatially divided deep reactive ion etching with ALD based passivation

F. Roozeboom, B.J. Kniknie, A.M. Lankhorst, G.J.J. Winands, R. Knaapen, M. Smets, P. Poodt, G. Dingemans, W. Keuning, W.M.M. Kessels

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)
2 Downloads (Pure)


Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles of 1) Si-etching with SF6 to form gaseous SiFx etch products, and 2) passivation with C4F8 polymerizing as a protecting fluorocarbon deposit on the sidewalls and bottom of the etched features. We report on a novel alternative and disruptive technology concept of Spatially-divided Deep Reactive Ion Etching, where the process is converted from the time-divided into the spatially divided regime. The spatial division can be accomplished by ~20 to 100 µm high inert gas-bearing ‘curtains’ that confine the reactive gases to individual (often linear) injection slots constructed in a gas injector head. By horizontally moving the substrate back and forth under the head one can realize the alternate exposures to compose the overall cycle.Next improvement in the spatially-divided approach is the replacement of the CVD-based C4F8 passivation steps by ALD-based oxide (e.g. SiO2) deposition cycles. The method can have industrial potential in cost-effective creation of advanced 3D TSV interconnects and MEMS, but also in advanced patterning of, e.g., nanoscale FinFET devices with reduced line edge roughness, thus approaching Atomic Layer Etching accuracy.
Original languageEnglish
Title of host publicationProcessing Materials of 3D Interconnects, Damascene and Electronics Packaging 4 (PRiME 2012), October 7, 2012 - October 12, 2012, Honolulu, HI
EditorsK. Kondo, E.J. Pdolaha-Murphy, S. Mathad, F. Roozeboom
Place of PublicationPennington, New Jersey
PublisherElectrochemical Society, Inc.
ISBN (Print)978-1-62332-068-3
Publication statusPublished - 2013

Publication series

NameECS Transactions
ISSN (Print)1938-6737


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