A multi-scale approach to functional signature analysis for product end-of-life management

T.R. Figarella Gomez, A. Di Bucchianico

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review


Electronic products tend to be economicaly outdated before their technical end-of-life has been reached. The ability to analyze and predict the (remaining) technical life of a product would make it possible either to re-use sub-assemblies in the manufacture process of new products, or to design products for which the technical and economical life match. This requires models to predict and monitor performance degradation profiles. In this paper we report on designed experiments to obtain such models. We show how wavelet analysis can be used to extract features from electrical signals. These features are analyzed using the Analysis of Variance in order to establish relations between these features and performance degradation.
Original languageEnglish
Title of host publicationProgress in Industrial Mathematics at ECMI 2004 (Proceedings 13th European Conference on Mathematics for Industry, Eindhoven, The Netherlands, June 21-25, 2004)
EditorsA. Di Bucchianico, R.M.M. Mattheij, M.A. Peletier
Place of PublicationBerlin
ISBN (Print)3-540-28073-1
Publication statusPublished - 2006

Publication series

NameMathematics in Industry
ISSN (Print)1612-3956


Dive into the research topics of 'A multi-scale approach to functional signature analysis for product end-of-life management'. Together they form a unique fingerprint.

Cite this