Electronic products tend to be economicaly outdated before their technical end-of-life has been reached. The ability to analyze and predict the (remaining) technical life of a product would make it possible either to re-use sub-assemblies in the manufacture process of new products, or to design products for which the technical and economical life match. This requires models to predict and monitor performance degradation profiles. In this paper we report on designed experiments to obtain such models. We show how wavelet analysis can be used to extract features from electrical signals. These features are analyzed using the Analysis of Variance in order to establish relations between these features and performance degradation.
|Title of host publication||Progress in Industrial Mathematics at ECMI 2004 (Proceedings 13th European Conference on Mathematics for Industry, Eindhoven, The Netherlands, June 21-25, 2004)|
|Editors||A. Di Bucchianico, R.M.M. Mattheij, M.A. Peletier|
|Place of Publication||Berlin|
|Publication status||Published - 2006|
|Name||Mathematics in Industry|
Figarella Gomez, T. R., & Di Bucchianico, A. (2006). A multi-scale approach to functional signature analysis for product end-of-life management. In A. Di Bucchianico, R. M. M. Mattheij, & M. A. Peletier (Eds.), Progress in Industrial Mathematics at ECMI 2004 (Proceedings 13th European Conference on Mathematics for Industry, Eindhoven, The Netherlands, June 21-25, 2004) (pp. 574-578). (Mathematics in Industry; Vol. 8). Springer. https://doi.org/10.1007/3-540-28073-1_86