A methodology to determine the sites of variability in an LED assembly

Robin Bornoff, Thomas Merelle, Josephine Sari, Alessandro Di Bucchianico, Gabor Farkas

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

Variations in the manufacturing assembly process together with any changes in materials sourcing can give rise to variation in the functional performance of an LED. These variations can lead to differences in thermal characteristics such as Zth (transient thermal impedance) and RthJC (thermal resistance between chip junction and case. This study aims to analyze the measured variations of a number of LED samples and explore a methodology that will provide insights into the root cause of those variations, In addition the statistical properties of the variations are applied in a Monte Carlo thermal modelling context. Such insights and modelling methods would be employed by a lighting engineer when selecting LEDs and when simulating their thermal dependent optical behavior.

Original languageEnglish
Title of host publication35th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
Pages61-65
Number of pages5
ISBN (Electronic)9781735532509
Publication statusPublished - Mar 2019
Event35th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2019 - San Jose, United States
Duration: 18 Mar 201922 Mar 2019

Conference

Conference35th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2019
Country/TerritoryUnited States
CitySan Jose
Period18/03/1922/03/19

Keywords

  • LED
  • Structure Function
  • Variation

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