A hybrid integration strategy for compact, broadband and highly efficient millimeter-wave on-chip antennas

Quinten Van den Brande (Corresponding author), Sam Lemey, Stijn Poelman, Olivier Caytan, Laurens Bogaert, Ad Reniers, Bart Smolders, Bart Kuyken, Dries Ginste Vande, Hendrik Rogier

Research output: Contribution to journalArticleAcademicpeer-review

4 Citations (Scopus)

Abstract

A novel hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave (mmWave) on-chip antennas is demonstrated by realizing a hybrid on-chip antenna, operating in the [27.5-29.5] GHz band. A cavity-backed stacked patch antenna is implemented on a 600 m thick silicon substrate by using air-filled substrate-integrated-waveguide technology. A hybrid on-chip approach is adopted in which the antenna feed and an air-filled cavity are integrated on-chip, and the stacked patch configuration is implemented on a high-frequency printed circuit board (PCB) laminate that supports the chip. A prototype of the hybrid on-chip antenna is validated, demonstrating an impedance bandwidth of 3.7 GHz. In free-space conditions, a boresight gain of 7.3 dBi and a front-to-back ratio of 20.3 dB at 28.5 GHz are achieved. Moreover, the antenna is fabricated using standard silicon fabrication techniques and features a total antenna efficiency above 90% in the targeted frequency band of operation. The high performance, in combination with the compact antenna footprint of text{0.49}lambda {rm min} times text{0.49}ambda {rm min}, makes it an ideal building block to construct broadband antenna arrays with a broad steering range.

Original languageEnglish
Article number8769935
Pages (from-to)2424-2428
Number of pages5
JournalIEEE Antennas and Wireless Propagation Letters
Volume18
Issue number11
DOIs
Publication statusPublished - 1 Nov 2019

Keywords

  • Air-filled substrate integrated waveguide (AFSIW)
  • broadband
  • high efficiency
  • millimeter-wave (mmWave)
  • on-chip antenna

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