Abstract
This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.
Original language | English |
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Publication status | Accepted/In press - 2025 |
Event | 19th European Conference on Antennas and Propagation - Stockholm, Sweden Duration: 30 Mar 2025 → 4 Apr 2025 |
Conference
Conference | 19th European Conference on Antennas and Propagation |
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Country/Territory | Sweden |
City | Stockholm |
Period | 30/03/25 → 4/04/25 |