A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding

Research output: Contribution to conferencePosterAcademic

Conference

Conference2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018)
Abbreviated titleProRISC 2018
CountryNetherlands
CityEnschede
Period7/06/188/06/18
Internet address

Cite this

Liu, X., Zhang, X., Leenaerts, D. M. W., & Matters-Kammerer, M. K. (2018). A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.
Liu, X. ; Zhang, X. ; Leenaerts, D.M.W. ; Matters-Kammerer, M. K./ A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.
@conference{27397f6ea3784ae9a7a6327efb0b59c1,
title = "A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding",
author = "X. Liu and X. Zhang and D.M.W. Leenaerts and Matters-Kammerer, {M. K.}",
year = "2018",
month = "6",
day = "7",
language = "English",
note = "2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), ProRISC 2018 ; Conference date: 07-06-2018 Through 08-06-2018",
url = "https://prorisc2018.eu/",

}

Liu, X, Zhang, X, Leenaerts, DMW & Matters-Kammerer, MK 2018, 'A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding' 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands, 7/06/18 - 8/06/18, .

A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding. / Liu, X.; Zhang, X.; Leenaerts, D.M.W.; Matters-Kammerer, M. K.

2018. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.

Research output: Contribution to conferencePosterAcademic

TY - CONF

T1 - A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding

AU - Liu,X.

AU - Zhang,X.

AU - Leenaerts,D.M.W.

AU - Matters-Kammerer,M. K.

PY - 2018/6/7

Y1 - 2018/6/7

M3 - Poster

ER -

Liu X, Zhang X, Leenaerts DMW, Matters-Kammerer MK. A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding. 2018. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.