A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding

X. Liu; X. Zhang; D.M.W. Leenaerts; M. K. Matters-Kammerer

A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding

X. Liu, X. Zhang, D.M.W. Leenaerts, M. K. Matters-Kammerer

Research output: Contribution to conference › Poster › Academic

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Original language	English
Publication status	Published - 7 Jun 2018
Event	2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018) - Bram Nauta, University of Twente, Enschede, Netherlands Duration: 7 Jun 2018 → 8 Jun 2018 https://prorisc2018.eu/

Conference

Conference	2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018)
Abbreviated title	ProRISC 2018
Country	Netherlands
City	Enschede
Period	7/06/18 → 8/06/18
Internet address	https://prorisc2018.eu/

Cite this

Liu, X., Zhang, X., Leenaerts, D. M. W., & Matters-Kammerer, M. K. (2018). A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.

@conference{27397f6ea3784ae9a7a6327efb0b59c1,

title = "A DC to 40 GHz linear driver for optical communication and wafer-to-wafer bonding",

author = "X. Liu and X. Zhang and D.M.W. Leenaerts and Matters-Kammerer, {M. K.}",

year = "2018",

month = jun,

day = "7",

language = "English",

note = "2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), ProRISC 2018 ; Conference date: 07-06-2018 Through 08-06-2018",

url = "https://prorisc2018.eu/",

}