A concept for accurate edge-coupled multi-fiber photonic interconnects

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Abstract

The alignment and fixation of multiple single-mode optical fibers to photonic integrated circuits is currently a challenging, expensive and time-consuming task. In this paper, we present a concept for a sub micrometer accurate multi-fiber array where fibers are actively aligned with respect to each other and fixated to a flat carrier using UV-curable adhesive. Adhesives are prone to shrinkage which can disturb the fiber alignment. As a result, especially the fixation process forms the bottleneck in reaching the required alignment and not the alignment process itself. Simulations are performed to investigate the sensitivity of process variables on the adhesive bond geometry which is important for the shrinkage amplitude. Furthermore an experimental setup has been designed and fabricated to measure the shrinkage induced fiber displacement for three selected types of adhesives. The results show a controllable adhesive shrinkage where fibers can be aligned with a position reproducibility of -40 nm which is more than sufficient for the most critical fiber alignment applications. With this concept an important step can be made in enabling sub-micrometer accurate photonic interconnects in a cost effective way which is suitable for automated production.
LanguageEnglish
JournalJournal of Lightwave Technology
DOIs
StateAccepted/In press - 17 Jan 2019

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adhesives
photonics
shrinkage
alignment
fibers
micrometers
integrated circuits
optical fibers
costs
sensitivity
geometry
simulation

Cite this

@article{611d9dd452c045068e0d8fc465b0ed52,
title = "A concept for accurate edge-coupled multi-fiber photonic interconnects",
abstract = "The alignment and fixation of multiple single-mode optical fibers to photonic integrated circuits is currently a challenging, expensive and time-consuming task. In this paper, we present a concept for a sub micrometer accurate multi-fiber array where fibers are actively aligned with respect to each other and fixated to a flat carrier using UV-curable adhesive. Adhesives are prone to shrinkage which can disturb the fiber alignment. As a result, especially the fixation process forms the bottleneck in reaching the required alignment and not the alignment process itself. Simulations are performed to investigate the sensitivity of process variables on the adhesive bond geometry which is important for the shrinkage amplitude. Furthermore an experimental setup has been designed and fabricated to measure the shrinkage induced fiber displacement for three selected types of adhesives. The results show a controllable adhesive shrinkage where fibers can be aligned with a position reproducibility of -40 nm which is more than sufficient for the most critical fiber alignment applications. With this concept an important step can be made in enabling sub-micrometer accurate photonic interconnects in a cost effective way which is suitable for automated production.",
author = "{van Gastel}, M.H.M. and P.C.J.N. Rosielle and M. Steinbuch",
year = "2019",
month = "1",
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doi = "10.1109/JLT.2019.2893702",
language = "English",
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issn = "0733-8724",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

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T1 - A concept for accurate edge-coupled multi-fiber photonic interconnects

AU - van Gastel,M.H.M.

AU - Rosielle,P.C.J.N.

AU - Steinbuch,M.

PY - 2019/1/17

Y1 - 2019/1/17

N2 - The alignment and fixation of multiple single-mode optical fibers to photonic integrated circuits is currently a challenging, expensive and time-consuming task. In this paper, we present a concept for a sub micrometer accurate multi-fiber array where fibers are actively aligned with respect to each other and fixated to a flat carrier using UV-curable adhesive. Adhesives are prone to shrinkage which can disturb the fiber alignment. As a result, especially the fixation process forms the bottleneck in reaching the required alignment and not the alignment process itself. Simulations are performed to investigate the sensitivity of process variables on the adhesive bond geometry which is important for the shrinkage amplitude. Furthermore an experimental setup has been designed and fabricated to measure the shrinkage induced fiber displacement for three selected types of adhesives. The results show a controllable adhesive shrinkage where fibers can be aligned with a position reproducibility of -40 nm which is more than sufficient for the most critical fiber alignment applications. With this concept an important step can be made in enabling sub-micrometer accurate photonic interconnects in a cost effective way which is suitable for automated production.

AB - The alignment and fixation of multiple single-mode optical fibers to photonic integrated circuits is currently a challenging, expensive and time-consuming task. In this paper, we present a concept for a sub micrometer accurate multi-fiber array where fibers are actively aligned with respect to each other and fixated to a flat carrier using UV-curable adhesive. Adhesives are prone to shrinkage which can disturb the fiber alignment. As a result, especially the fixation process forms the bottleneck in reaching the required alignment and not the alignment process itself. Simulations are performed to investigate the sensitivity of process variables on the adhesive bond geometry which is important for the shrinkage amplitude. Furthermore an experimental setup has been designed and fabricated to measure the shrinkage induced fiber displacement for three selected types of adhesives. The results show a controllable adhesive shrinkage where fibers can be aligned with a position reproducibility of -40 nm which is more than sufficient for the most critical fiber alignment applications. With this concept an important step can be made in enabling sub-micrometer accurate photonic interconnects in a cost effective way which is suitable for automated production.

UR - https://ieeexplore.ieee.org/document/8616799

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SN - 0733-8724

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