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A clustering technique for fast electrothermal analysis of on-chip power distribution networks

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Abstract

This paper presents an equivalent self-consistent electrothermal circuit model for power integrity analysis of large on-chip power distribution networks. Two coupled circuits are used to co-simulate the electrical and thermal behavior of the power grid. After a steady-state analysis, the order of the circuit is strongly reduced by means of a node clustering technique. The obtained low-order circuit allows a cost-effective complete power integrity analysis, including dynamic analysis and evaluation of time-domain features like voltage droop. As a case-study, a 45-nm chip power grid is analyzed: the full circuit for the electrothermal model with 4 million nodes is reduced by a factor of about 3500×, with a relative error on the solution below few percent.

Original languageEnglish
Title of host publication2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
Number of pages4
ISBN (Electronic)9781509003495
DOIs
Publication statusPublished - 20 Jun 2016
Externally publishedYes
Event20th IEEE Workshop on Signal and Power Integrity, SPI 2016 - Turin, Italy
Duration: 8 May 201611 May 2016

Conference

Conference20th IEEE Workshop on Signal and Power Integrity, SPI 2016
Country/TerritoryItaly
CityTurin
Period8/05/1611/05/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

  • electrothermal analysis
  • IR-drop
  • model order reduction
  • On-chip power distribution networks
  • power integrity

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