A 60GHz LC-VCO module using flip-chip on a laminate substrate

M. Notten; H. Veenstra; X. Huang; J. B. Mills

A 60GHz LC-VCO module using flip-chip on a laminate substrate

M. Notten
, H. Veenstra
, X. Huang
, J. B. Mills

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation results of a 60GHz LC-VCO module using flip-chip. The impact of the substrate on on-chip CPW transmission lines and spiral inductors is studied based on the performance of a 60GHz LC-VCO. Since the inductor is part of the VCO resonator, a remarkable 10% increase in oscillation frequency occurs due to the nearby top-metal layer of the substrate. The IC is realized in a 0.25μm SiGe BiCMOS process. The 0.44mm thick substrate offers four copper signal layers.

Original language	English
Title of host publication	European Microwave Week 2009, EuMW 2009
Subtitle of host publication	Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 4th European Microwave Integrated Circuits Conference, EuMIC 2009
Pages	415-418
Number of pages	4
Publication status	Published - 2009
Event	12th European Microwave Week, EuMW 2009 - Rome, Italy Duration: 30 Sept 2009 → 2 Oct 2009 Conference number: 12

Conference

Conference	12th European Microwave Week, EuMW 2009
Abbreviated title	EuMW 2009
Country/Territory	Italy
City	Rome
Period	30/09/09 → 2/10/09

Cite this

@inproceedings{38c346db116044979da2b6cb63d4cc2f,

title = "A 60GHz LC-VCO module using flip-chip on a laminate substrate",

abstract = "For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation results of a 60GHz LC-VCO module using flip-chip. The impact of the substrate on on-chip CPW transmission lines and spiral inductors is studied based on the performance of a 60GHz LC-VCO. Since the inductor is part of the VCO resonator, a remarkable 10\% increase in oscillation frequency occurs due to the nearby top-metal layer of the substrate. The IC is realized in a 0.25μm SiGe BiCMOS process. The 0.44mm thick substrate offers four copper signal layers.",

author = "M. Notten and H. Veenstra and X. Huang and Mills, \{J. B.\}",

year = "2009",

language = "English",

isbn = "9782874870125",

pages = "415--418",

booktitle = "European Microwave Week 2009, EuMW 2009",

note = "12th European Microwave Week, EuMW 2009, EuMW 2009 ; Conference date: 30-09-2009 Through 02-10-2009",

}

Notten, M, Veenstra, H, Huang, X & Mills, JB 2009, A 60GHz LC-VCO module using flip-chip on a laminate substrate. in European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 4th European Microwave Integrated Circuits Conference, EuMIC 2009., 5296499, pp. 415-418, 12th European Microwave Week, EuMW 2009, Rome, Italy, 30/09/09.

A 60GHz LC-VCO module using flip-chip on a laminate substrate. / Notten, M.; Veenstra, H.; Huang, X. et al.
European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 4th European Microwave Integrated Circuits Conference, EuMIC 2009. 2009. p. 415-418 5296499.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - A 60GHz LC-VCO module using flip-chip on a laminate substrate

AU - Notten, M.

AU - Veenstra, H.

AU - Huang, X.

AU - Mills, J. B.

N1 - Conference code: 12

PY - 2009

Y1 - 2009

N2 - For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation results of a 60GHz LC-VCO module using flip-chip. The impact of the substrate on on-chip CPW transmission lines and spiral inductors is studied based on the performance of a 60GHz LC-VCO. Since the inductor is part of the VCO resonator, a remarkable 10% increase in oscillation frequency occurs due to the nearby top-metal layer of the substrate. The IC is realized in a 0.25μm SiGe BiCMOS process. The 0.44mm thick substrate offers four copper signal layers.

AB - For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation results of a 60GHz LC-VCO module using flip-chip. The impact of the substrate on on-chip CPW transmission lines and spiral inductors is studied based on the performance of a 60GHz LC-VCO. Since the inductor is part of the VCO resonator, a remarkable 10% increase in oscillation frequency occurs due to the nearby top-metal layer of the substrate. The IC is realized in a 0.25μm SiGe BiCMOS process. The 0.44mm thick substrate offers four copper signal layers.

UR - https://www.scopus.com/pages/publications/72449175909

M3 - Conference contribution

AN - SCOPUS:72449175909

SN - 9782874870125

SP - 415

EP - 418

BT - European Microwave Week 2009, EuMW 2009

T2 - 12th European Microwave Week, EuMW 2009

Y2 - 30 September 2009 through 2 October 2009

ER -

A 60GHz LC-VCO module using flip-chip on a laminate substrate

Abstract

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