A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

LanguageEnglish
Title of host publication2018 18th Mediterranean Microwave Symposium, MMS 2018
PublisherIEEE Computer Society
Pages112-115
Number of pages4
ISBN (Electronic)9781538671320
DOIs
StatePublished - 14 Jan 2019
Event18th Mediterranean Microwave Symposium, MMS 2018 - Istanbul, Turkey
Duration: 31 Oct 20182 Nov 2018

Conference

Conference18th Mediterranean Microwave Symposium, MMS 2018
CountryTurkey
CityIstanbul
Period31/10/182/11/18

Fingerprint

Pulse amplitude modulation
Light modulators
Photonics
Packaging
Polymers
Optical communication
Mechanics
Bandwidth
Silicon

Keywords

  • Driver circuits
  • Optical driver IC
  • PAM-4
  • Through-polymer via
  • Wafer Scale integration

Cite this

@inproceedings{5dd0749d30154c568440ce62d8b890b6,
title = "A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging",
abstract = "This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.",
keywords = "Driver circuits, Optical driver IC, PAM-4, Through-polymer via, Wafer Scale integration",
author = "Xi Zhang and Xiao Liu and Marc Spiegelberg and Arezou Meighan and {van der Tol}, {Jos J.G.M.} and Matters-Kammerer, {Marion K.}",
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pages = "112--115",
booktitle = "2018 18th Mediterranean Microwave Symposium, MMS 2018",
publisher = "IEEE Computer Society",
address = "United States",

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Zhang, X, Liu, X, Spiegelberg, M, Meighan, A, van der Tol, JJGM & Matters-Kammerer, MK 2019, A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. in 2018 18th Mediterranean Microwave Symposium, MMS 2018., 8611895, IEEE Computer Society, pp. 112-115, 18th Mediterranean Microwave Symposium, MMS 2018, Istanbul, Turkey, 31/10/18. DOI: 10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. / Zhang, Xi; Liu, Xiao; Spiegelberg, Marc; Meighan, Arezou; van der Tol, Jos J.G.M.; Matters-Kammerer, Marion K.

2018 18th Mediterranean Microwave Symposium, MMS 2018. IEEE Computer Society, 2019. p. 112-115 8611895.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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AB - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

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Zhang X, Liu X, Spiegelberg M, Meighan A, van der Tol JJGM, Matters-Kammerer MK. A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. In 2018 18th Mediterranean Microwave Symposium, MMS 2018. IEEE Computer Society. 2019. p. 112-115. 8611895. Available from, DOI: 10.1109/MMS.2018.8611895