A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang; Xiao Liu; Marc Spiegelberg; Arezou Meighan; Jos J.G.M. van der Tol; Marion K. Matters-Kammerer

doi:10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang, Xiao Liu, Marc Spiegelberg, Arezou Meighan, Jos J.G.M. van der Tol, Marion K. Matters-Kammerer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

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Abstract

This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

Original language	English
Title of host publication	2018 18th Mediterranean Microwave Symposium, MMS 2018
Publisher	IEEE Computer Society
Pages	112-115
Number of pages	4
ISBN (Electronic)	9781538671320
DOIs	https://doi.org/10.1109/MMS.2018.8611895
Publication status	Published - 14 Jan 2019
Event	18th Mediterranean Microwave Symposium, MMS 2018 - Istanbul, Turkey Duration: 31 Oct 2018 → 2 Nov 2018

Conference

Conference	18th Mediterranean Microwave Symposium, MMS 2018
Country/Territory	Turkey
City	Istanbul
Period	31/10/18 → 2/11/18

Keywords

Driver circuits
Optical driver IC
PAM-4
Through-polymer via
Wafer Scale integration

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10.1109/MMS.2018.8611895

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@inproceedings{5dd0749d30154c568440ce62d8b890b6,

title = "A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging",

abstract = "This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.",

keywords = "Driver circuits, Optical driver IC, PAM-4, Through-polymer via, Wafer Scale integration",

author = "Xi Zhang and Xiao Liu and Marc Spiegelberg and Arezou Meighan and {van der Tol}, {Jos J.G.M.} and Matters-Kammerer, {Marion K.}",

year = "2019",

month = jan,

day = "14",

doi = "10.1109/MMS.2018.8611895",

language = "English",

pages = "112--115",

booktitle = "2018 18th Mediterranean Microwave Symposium, MMS 2018",

publisher = "IEEE Computer Society",

address = "United States",

note = "18th Mediterranean Microwave Symposium, MMS 2018 ; Conference date: 31-10-2018 Through 02-11-2018",

}

Zhang, X, Liu, X, Spiegelberg, M, Meighan, A, van der Tol, JJGM & Matters-Kammerer, MK 2019, A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. in 2018 18th Mediterranean Microwave Symposium, MMS 2018., 8611895, IEEE Computer Society, pp. 112-115, 18th Mediterranean Microwave Symposium, MMS 2018, Istanbul, Turkey, 31/10/18. https://doi.org/10.1109/MMS.2018.8611895

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AU - Zhang, Xi

AU - Liu, Xiao

AU - Spiegelberg, Marc

AU - Meighan, Arezou

AU - van der Tol, Jos J.G.M.

AU - Matters-Kammerer, Marion K.

PY - 2019/1/14

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N2 - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

AB - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

KW - Driver circuits

KW - Optical driver IC

KW - PAM-4

KW - Through-polymer via

KW - Wafer Scale integration

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BT - 2018 18th Mediterranean Microwave Symposium, MMS 2018

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Y2 - 31 October 2018 through 2 November 2018

ER -

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

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