A 3nW signal-acquisition IC integrating an amplifier with 2.1 NEF and a 1.5fJ/conv-step ADC

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Abstract

Signal acquisition systems for emerging applications, such as impiantatile or unobtrusively wearable autonomous sensors, large sensor arrays, or wireless self-powered sensors, require a minuscule form factor and very low power consumption. For example, the power available from a state-of-the-art 1mm3 solid-state thin-film battery is limited to 4nWfora 10yr lifetime [1], and a 1mm3 energy harvester attached to a running person delivers only 7.4nW [2]. While several low-power signal acquisition systems have been proposed [3-5], their consumption is still in the 20-to-1000nW range. Circuits aiming at low absolute power often result in low power-efficiency (due to overhead), high PVT sensitivity and poor reliability (due to the use of simplistic circuitry). This work presents a fully-integrated signal acquisition IC with six-fold lower power consumption than prior art, which provides state-of-the-art power-efficiency and ensures enough circuit reliability, precision and bandwidth to enable practical applications.
Original languageEnglish
Title of host publicationProceedings of the IEEE International Solid-State Circuits Conference, 22-26 Februari 2015, San Francisco, California
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages382-383
ISBN (Print)978-1-4799-6223-5
DOIs
Publication statusPublished - 2015
Event62nd IEEE International Solid-State Circuits Conference,(ISSCC 2015) - San Francisco Marriott, San Francisco, United States
Duration: 22 Feb 201526 Feb 2015
Conference number: 62

Conference

Conference62nd IEEE International Solid-State Circuits Conference,(ISSCC 2015)
Abbreviated titleISSCC 2015
CountryUnited States
CitySan Francisco
Period22/02/1526/02/15

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Harpe, P. J. A., Gao, H., Dommele, van, A. R., Cantatore, E., & Roermund, van, A. H. M. (2015). A 3nW signal-acquisition IC integrating an amplifier with 2.1 NEF and a 1.5fJ/conv-step ADC. In Proceedings of the IEEE International Solid-State Circuits Conference, 22-26 Februari 2015, San Francisco, California (pp. 382-383). Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISSCC.2015.7063086