Abstract
This paper describes a temperature sensor realized in a 65nm CMOS process with a batch-calibrated inaccuracy of ±0.5°C (3σ) and a trimmed inaccuracy of ±0.2°C (3σ) from -70°C to 125°C. This represents a 10-fold improvement in accuracy compared to other deep-submicron temperature sensors [1,2], and is comparable with that of state-of-the-art sensors implemented in larger-featuresize processes [3,4]. The sensor draws 8.3μA from a 1.2V supply and occupies an area of 0.1mm2, which is 45 times less than that of sensors with comparable accuracy [3,4]. These advances are enabled by the use of NPN transistors as sensing elements, the use of dynamic techniques i.e. correlated double sampling (CDS) and dynamic element matching (DEM), and a single room-temperature trim.
Original language | English |
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Title of host publication | 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - Digest of Technical Papers |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 312-313 |
Number of pages | 2 |
ISBN (Electronic) | 978-1-4244-6036-6 |
ISBN (Print) | 978-1-4244-6033-5 |
DOIs | |
Publication status | Published - 18 May 2010 |
Event | 57th IEEE International Solid-State Circuits Conference, ISSCC 2010 - San Francisco, United States Duration: 7 Feb 2010 → 11 Feb 2010 Conference number: 57 |
Conference
Conference | 57th IEEE International Solid-State Circuits Conference, ISSCC 2010 |
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Abbreviated title | ISSCC 2010 |
Country/Territory | United States |
City | San Francisco |
Period | 7/02/10 → 11/02/10 |