A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics

Teng Li (Corresponding author), Chenhui Li, Jasper Nab, Ripalta Stabile, Oded Raz

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.

Original languageEnglish
Article number8897650
Pages (from-to)1999-2002
Number of pages4
JournalIEEE Photonics Technology Letters
Volume31
Issue number24
DOIs
Publication statusPublished - 15 Dec 2019

Keywords

  • Ceramics
  • chip scale packaging
  • flip-chip devices
  • optical receivers
  • optical transmitters
  • photo-imageable thick film technologies

Fingerprint Dive into the research topics of 'A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics'. Together they form a unique fingerprint.

  • Cite this