Abstract
A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.
Original language | English |
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Article number | 8897650 |
Pages (from-to) | 1999-2002 |
Number of pages | 4 |
Journal | IEEE Photonics Technology Letters |
Volume | 31 |
Issue number | 24 |
DOIs | |
Publication status | Published - 15 Dec 2019 |
Keywords
- Ceramics
- chip scale packaging
- flip-chip devices
- optical receivers
- optical transmitters
- photo-imageable thick film technologies