A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics

Teng Li; Chenhui Li; Jasper Nab; Ripalta Stabile; Oded Raz

doi:10.1109/LPT.2019.2953267

A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics

Teng Li (Corresponding author), Chenhui Li, Jasper Nab, Ripalta Stabile, Oded Raz

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Abstract

A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.

Original language	English
Article number	8897650
Pages (from-to)	1999-2002
Number of pages	4
Journal	IEEE Photonics Technology Letters
Volume	31
Issue number	24
DOIs	https://doi.org/10.1109/LPT.2019.2953267
Publication status	Published - 15 Dec 2019

Keywords

Ceramics
chip scale packaging
flip-chip devices
optical receivers
optical transmitters
photo-imageable thick film technologies

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10.1109/LPT.2019.2953267

08897650Final published version, 2.46 MBLicence: TAVERNE

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@article{5a64ce2b788c4efc8c1e4c3a87962fe9,

title = "A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics",

abstract = "A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.",

keywords = "Ceramics, chip scale packaging, flip-chip devices, optical receivers, optical transmitters, photo-imageable thick film technologies",

author = "Teng Li and Chenhui Li and Jasper Nab and Ripalta Stabile and Oded Raz",

year = "2019",

month = dec,

day = "15",

doi = "10.1109/LPT.2019.2953267",

language = "English",

volume = "31",

pages = "1999--2002",

journal = "IEEE Photonics Technology Letters",

issn = "1041-1135",

publisher = "Institute of Electrical and Electronics Engineers",

number = "24",

}

TY - JOUR

T1 - A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics

AU - Li, Teng

AU - Li, Chenhui

AU - Nab, Jasper

AU - Stabile, Ripalta

AU - Raz, Oded

PY - 2019/12/15

Y1 - 2019/12/15

N2 - A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.

AB - A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.

KW - Ceramics

KW - chip scale packaging

KW - flip-chip devices

KW - optical receivers

KW - optical transmitters

KW - photo-imageable thick film technologies

UR - http://www.scopus.com/inward/record.url?scp=85077230082&partnerID=8YFLogxK

U2 - 10.1109/LPT.2019.2953267

DO - 10.1109/LPT.2019.2953267

M3 - Article

AN - SCOPUS:85077230082

VL - 31

SP - 1999

EP - 2002

JO - IEEE Photonics Technology Letters

JF - IEEE Photonics Technology Letters

SN - 1041-1135

IS - 24

M1 - 8897650

ER -

A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics

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