Abstract
A ceramics-based 100 Gbps optical transceiver engine is demonstrated. A ceramics-based interposer is fabricated using the multilayer thick film (MLTF) and photo-imageable thick film (PITF) technologies, which allow for multilayer metallization and ultra-fine resolution. The packaging method requires several flip-chip bonding steps using industry standard solder reflow and ultrasonic bonding processes. The assembled 4-channel optical engine performs error-free at 25.78 Gbps. Bit error rates (BER) and eye diagrams for all channels for both transmitter and receiver side are measured. Further, a crosstalk below 0.4 dB from adjacent channels is measured.
| Original language | English |
|---|---|
| Article number | 8897650 |
| Pages (from-to) | 1999-2002 |
| Number of pages | 4 |
| Journal | IEEE Photonics Technology Letters |
| Volume | 31 |
| Issue number | 24 |
| DOIs | |
| Publication status | Published - 15 Dec 2019 |
Funding
Manuscript received June 3, 2019; revised October 14, 2019; accepted November 4, 2019. Date of publication November 13, 2019; date of current version December 19, 2019. This work was supported by the Netherlands Organization of Scientific Research (NWO) Project-an optically connected CMOS Ethernet switch IC under Grant 13184. (Corresponding author: Teng Li.) T. Li, C. Li, R. Stabile, and O. Raz are with the Department of Electrical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The Netherlands (e-mail: [email protected]; [email protected]; [email protected]; [email protected]).
Keywords
- Ceramics
- chip scale packaging
- flip-chip devices
- optical receivers
- optical transmitters
- photo-imageable thick film technologies