Abstract
Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards - targeting multiple application domains/markets - while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area.
| Original language | English |
|---|---|
| Title of host publication | 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 186-187 |
| Number of pages | 2 |
| ISBN (Electronic) | 978-1-4799-0920-9 |
| ISBN (Print) | 978-1-4799-0918-6 |
| DOIs | |
| Publication status | Published - 1 Jan 2014 |
| Event | 61st IEEE International Solid-State Circuits Conference, ISSCC 2014 - San Francisco, United States Duration: 9 Feb 2014 → 13 Feb 2014 Conference number: 61 |
Publication series
| Name | IEEE Digest of Technical Papers |
|---|---|
| Volume | 57 |
Conference
| Conference | 61st IEEE International Solid-State Circuits Conference, ISSCC 2014 |
|---|---|
| Abbreviated title | ISSCC 2014 |
| Country/Territory | United States |
| City | San Francisco |
| Period | 9/02/14 → 13/02/14 |
| Other | “Silicon Systems Bridging the Cloud” |
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