A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks

Christian Bachmann; Gert Jan van Schaik; Benjamin Busze; Mario Konijnenburg; Yan Zhang; Jan Stuyt; Maryam Ashouei; Guido Dolmans; Tobias Gemmeke; Harmke de Groot

doi:10.1109/ISSCC.2014.6757393

A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks

Christian Bachmann, Gert Jan van Schaik, Benjamin Busze, Mario Konijnenburg, Yan Zhang, Jan Stuyt, Maryam Ashouei, Guido Dolmans, Tobias Gemmeke, Harmke de Groot

Integrated Circuits

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

18 Citations (Scopus)

Abstract

Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards - targeting multiple application domains/markets - while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area.

Original language	English
Title of host publication	2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	186-187
Number of pages	2
Volume	57
ISBN (Electronic)	978-1-4799-0920-9
ISBN (Print)	978-1-4799-0918-6
DOIs	https://doi.org/10.1109/ISSCC.2014.6757393
Publication status	Published - 1 Jan 2014
Event	61st IEEE International Solid-State Circuits Conference, ISSCC 2014 - San Francisco, United States Duration: 9 Feb 2014 → 13 Feb 2014 Conference number: 61

Conference

Conference	61st IEEE International Solid-State Circuits Conference, ISSCC 2014
Abbreviated title	ISSCC 2014
Country/Territory	United States
City	San Francisco
Period	9/02/14 → 13/02/14
Other	“Silicon Systems Bridging the Cloud”

Access to Document

10.1109/ISSCC.2014.6757393

Cite this

Bachmann, C., van Schaik, G. J., Busze, B., Konijnenburg, M., Zhang, Y., Stuyt, J., Ashouei, M., Dolmans, G., Gemmeke, T., & de Groot, H. (2014). A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks. In 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers (Vol. 57, pp. 186-187). Article 6757393 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISSCC.2014.6757393

Bachmann, Christian ; van Schaik, Gert Jan ; Busze, Benjamin et al. / A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks. 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers. Vol. 57 Piscataway : Institute of Electrical and Electronics Engineers, 2014. pp. 186-187

@inproceedings{b3cf6b2c507f4b53852b76a321a8199f,

title = "A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks",

abstract = "Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards - targeting multiple application domains/markets - while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area.",

author = "Christian Bachmann and {van Schaik}, {Gert Jan} and Benjamin Busze and Mario Konijnenburg and Yan Zhang and Jan Stuyt and Maryam Ashouei and Guido Dolmans and Tobias Gemmeke and {de Groot}, Harmke",

year = "2014",

month = jan,

day = "1",

doi = "10.1109/ISSCC.2014.6757393",

language = "English",

isbn = "978-1-4799-0918-6",

volume = "57",

pages = "186--187",

booktitle = "2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "61st IEEE International Solid-State Circuits Conference, ISSCC 2014, ISSCC 2014 ; Conference date: 09-02-2014 Through 13-02-2014",

}

Bachmann, C, van Schaik, GJ, Busze, B, Konijnenburg, M, Zhang, Y, Stuyt, J, Ashouei, M, Dolmans, G, Gemmeke, T & de Groot, H 2014, A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks. in 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers. vol. 57, 6757393, Institute of Electrical and Electronics Engineers, Piscataway, pp. 186-187, 61st IEEE International Solid-State Circuits Conference, ISSCC 2014, San Francisco, California, United States, 9/02/14. https://doi.org/10.1109/ISSCC.2014.6757393

A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks. / Bachmann, Christian; van Schaik, Gert Jan; Busze, Benjamin et al.
2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers. Vol. 57 Piscataway: Institute of Electrical and Electronics Engineers, 2014. p. 186-187 6757393.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks

AU - Bachmann, Christian

AU - van Schaik, Gert Jan

AU - Busze, Benjamin

AU - Konijnenburg, Mario

AU - Zhang, Yan

AU - Stuyt, Jan

AU - Ashouei, Maryam

AU - Dolmans, Guido

AU - Gemmeke, Tobias

AU - de Groot, Harmke

N1 - Conference code: 61

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards - targeting multiple application domains/markets - while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area.

AB - Ultra-low-power (ULP), short-range wireless connectivity is becoming increasingly relevant to a wide range of sensor and actuator node applications, ranging from consumer lifestyle to medical applications. In recent years, a multitude of wireless standards has been proposed to meet differing requirements of individual application domains such as data rates, range, QoS, peak and average power consumption. From a commercial perspective, a single radio component that is capable of supporting multiple wireless standards - targeting multiple application domains/markets - while reducing integration costs is highly preferable. At the same time, the multi-standard support may not compromise low-power operation or silicon area.

UR - http://www.scopus.com/inward/record.url?scp=84898067572&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2014.6757393

DO - 10.1109/ISSCC.2014.6757393

M3 - Conference contribution

AN - SCOPUS:84898067572

SN - 978-1-4799-0918-6

VL - 57

SP - 186

EP - 187

BT - 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 61st IEEE International Solid-State Circuits Conference, ISSCC 2014

Y2 - 9 February 2014 through 13 February 2014

ER -

Bachmann C, van Schaik GJ, Busze B, Konijnenburg M, Zhang Y, Stuyt J et al. A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks. In 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers. Vol. 57. Piscataway: Institute of Electrical and Electronics Engineers. 2014. p. 186-187. 6757393 doi: 10.1109/ISSCC.2014.6757393

A 0.74V 200µW multi-standard transceiver digital baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 personal area networks

Abstract

Conference

Access to Document

Other files and links

Fingerprint

Cite this