A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing

Haoming Xin; Martin Andraud; Peter G.M. Baltus; Eugenio Cantatore; Pieter J.A. Harpe

doi:10.1109/ESSCIRC.2019.8902918

A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing

Haoming Xin, Martin Andraud, Peter G.M. Baltus, Eugenio Cantatore, Pieter J.A. Harpe

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

7 Citations (Scopus)

2 Downloads (Pure)

Abstract

A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.

Original language	English
Title of host publication	ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	161-164
Number of pages	4
ISBN (Electronic)	978-1-7281-1550-4
DOIs	https://doi.org/10.1109/ESSCIRC.2019.8902918
Publication status	Published - Sep 2019
Event	45th European Solid State Circuits Conference (ESSCIRC 2019) - Cracow, Poland Duration: 23 Sep 2019 → 26 Sep 2019 Conference number: 45

Conference

Conference	45th European Solid State Circuits Conference (ESSCIRC 2019)
Abbreviated title	ESSCIRC 2019
Country/Territory	Poland
City	Cracow
Period	23/09/19 → 26/09/19

Keywords

All-Dynamic
Duty-Cycle
IoT
Multimodal Sensing
SAR ADC
Versatile Sensor Interface

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10.1109/ESSCIRC.2019.8902918

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Xin, H., Andraud, M., Baltus, P. G. M., Cantatore, E., & Harpe, P. J. A. (2019). A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing. In ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference (pp. 161-164). [8902918] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESSCIRC.2019.8902918

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title = "A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing",

abstract = "A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.",

keywords = "All-Dynamic, Duty-Cycle, IoT, Multimodal Sensing, SAR ADC, Versatile Sensor Interface",

author = "Haoming Xin and Martin Andraud and Baltus, {Peter G.M.} and Eugenio Cantatore and Harpe, {Pieter J.A.}",

year = "2019",

month = sep,

doi = "10.1109/ESSCIRC.2019.8902918",

language = "English",

pages = "161--164",

booktitle = "ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference",

publisher = "Institute of Electrical and Electronics Engineers",

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note = "45th European Solid State Circuits Conference (ESSCIRC 2019), ESSCIRC 2019 ; Conference date: 23-09-2019 Through 26-09-2019",

}

Xin, H, Andraud, M, Baltus, PGM , Cantatore, E & Harpe, PJA 2019, A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing. in ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference., 8902918, Institute of Electrical and Electronics Engineers, Piscataway, pp. 161-164, 45th European Solid State Circuits Conference (ESSCIRC 2019), Cracow, Poland, 23/09/19. https://doi.org/10.1109/ESSCIRC.2019.8902918

A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing. / Xin, Haoming; Andraud, Martin; Baltus, Peter G.M.; Cantatore, Eugenio ; Harpe, Pieter J.A.

ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference. Piscataway : Institute of Electrical and Electronics Engineers, 2019. p. 161-164 8902918.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Xin, Haoming

AU - Andraud, Martin

AU - Baltus, Peter G.M.

AU - Cantatore, Eugenio

AU - Harpe, Pieter J.A.

N1 - Conference code: 45

PY - 2019/9

Y1 - 2019/9

N2 - A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.

AB - A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.

KW - All-Dynamic

KW - Duty-Cycle

KW - IoT

KW - Multimodal Sensing

KW - SAR ADC

KW - Versatile Sensor Interface

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EP - 164

BT - ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 45th European Solid State Circuits Conference (ESSCIRC 2019)

Y2 - 23 September 2019 through 26 September 2019

ER -

A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing

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Keywords

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