Abstract
| Original language | English |
|---|---|
| Title of host publication | ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 161-164 |
| Number of pages | 4 |
| ISBN (Electronic) | 978-1-7281-1550-4 |
| DOIs | |
| Publication status | Published - Sep 2019 |
| Event | IEEE 45th European Solid State Circuits Conference (ESSCIRC2019) - Cracow, Poland Duration: 23 Sep 2019 → 26 Sep 2019 |
Conference
| Conference | IEEE 45th European Solid State Circuits Conference (ESSCIRC2019) |
|---|---|
| Country | Poland |
| City | Cracow |
| Period | 23/09/19 → 26/09/19 |
Fingerprint
Keywords
- All-Dynamic
- Duty-Cycle
- IoT
- Multimodal Sensing
- SAR ADC
- Versatile Sensor Interface
Cite this
}
A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing. / Xin, Haoming; Andraud, Martin; Baltus, Peter G.M.; Cantatore, Eugenio; Harpe, Pieter J.A.
ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference. Piscataway : Institute of Electrical and Electronics Engineers, 2019. p. 161-164 8902918.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
TY - GEN
T1 - A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing
AU - Xin, Haoming
AU - Andraud, Martin
AU - Baltus, Peter G.M.
AU - Cantatore, Eugenio
AU - Harpe, Pieter J.A.
PY - 2019/9
Y1 - 2019/9
N2 - A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.
AB - A highly versatile all-dynamic sensor interface is proposed. It supports temperature/capacitance/resistance sensing with (a) adaptive power vs speed and resolution, (b) a configurable signal range, and (c) the ability for time-interleaved multimodal recording. State-of-the-art Figure-of-Merits (FoMs) are achieved of 0.82pJ•C^2 , 31fJ/c.-step, and 124fJ/c.-step, for temperature, capacitance and resistance sensing, respectively, with a minimum power consumption of 0.34nW and a chip area of 0.084mm^2 in 65nm CMOS. Multimodal sensing is demonstrated in real time, showing that this chip can measure temperature, acceleration (with a capacitive sensor) and pH (with a resistive sensor) together with only 1.4nW of power consumption.
KW - All-Dynamic
KW - Duty-Cycle
KW - IoT
KW - Multimodal Sensing
KW - SAR ADC
KW - Versatile Sensor Interface
UR - http://www.scopus.com/inward/record.url?scp=85075914814&partnerID=8YFLogxK
U2 - 10.1109/ESSCIRC.2019.8902918
DO - 10.1109/ESSCIRC.2019.8902918
M3 - Conference contribution
SP - 161
EP - 164
BT - ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference
PB - Institute of Electrical and Electronics Engineers
CY - Piscataway
ER -