56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging

Research output: Contribution to conferencePosterAcademic

Abstract

In this poster, an optical modulator driver which is designed for electronic and photonic wafer scale packaging is presented. By using the polymer adhesive bonding technique, Silicon Electronic
Integrated Circuits (EICs) bond to the InP Photonic Integrated circuits (PICs) on the wafer scale. Small through polymer vias (TPVs) connect EICs to the PICs which reduces the parasitics and improves the maximum date rate. The presented optical modulator driver is designed for wafer scale packaging which optimizes the interface between PIC and EIC, result in a power efficient and high speed circuit. Moreover, the driver output provides a DC voltage bias for  the optical modulator without using a bias-T. The driver is measured with 3 dB bandwidth of 31.5 GHz and a data rate of 56 Gb/s PAM-4 with 3 Vpp output voltage swing 

Conference

Conference2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018)
Abbreviated titleProRISC 2018
CountryNetherlands
CityEnschede
Period7/06/188/06/18
Internet address

Fingerprint

Pulse amplitude modulation
Light modulators
Integrated circuits
Packaging
Photonics
Polymers
Bias voltage
Adhesives
Bandwidth
Silicon
Networks (circuits)
Electric potential

Cite this

Zhang, X., Liu, X., & Matters-Kammerer, M. K. (2018). 56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.
Zhang, X. ; Liu, X. ; Matters-Kammerer, M. K./ 56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.
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title = "56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging",
abstract = "In this poster, an optical modulator driver which is designed for electronic and photonic wafer scale packaging is presented. By using the polymer adhesive bonding technique, Silicon ElectronicIntegrated Circuits (EICs) bond to the InP Photonic Integrated circuits (PICs) on the wafer scale. Small through polymer vias (TPVs) connect EICs to the PICs which reduces the parasitics and improves the maximum date rate. The presented optical modulator driver is designed for wafer scale packaging which optimizes the interface between PIC and EIC, result in a power efficient and high speed circuit. Moreover, the driver output provides a DC voltage bias for  the optical modulator without using a bias-T. The driver is measured with 3 dB bandwidth of 31.5 GHz and a data rate of 56 Gb/s PAM-4 with 3 Vpp output voltage swing ",
author = "X. Zhang and X. Liu and Matters-Kammerer, {M. K.}",
year = "2018",
month = "6",
day = "8",
language = "English",
note = "2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), ProRISC 2018 ; Conference date: 07-06-2018 Through 08-06-2018",
url = "https://prorisc2018.eu/",

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Zhang, X, Liu, X & Matters-Kammerer, MK 2018, '56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging' 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands, 7/06/18 - 8/06/18, .

56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging. / Zhang, X.; Liu, X.; Matters-Kammerer, M. K.

2018. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.

Research output: Contribution to conferencePosterAcademic

TY - CONF

T1 - 56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging

AU - Zhang,X.

AU - Liu,X.

AU - Matters-Kammerer,M. K.

PY - 2018/6/8

Y1 - 2018/6/8

N2 - In this poster, an optical modulator driver which is designed for electronic and photonic wafer scale packaging is presented. By using the polymer adhesive bonding technique, Silicon ElectronicIntegrated Circuits (EICs) bond to the InP Photonic Integrated circuits (PICs) on the wafer scale. Small through polymer vias (TPVs) connect EICs to the PICs which reduces the parasitics and improves the maximum date rate. The presented optical modulator driver is designed for wafer scale packaging which optimizes the interface between PIC and EIC, result in a power efficient and high speed circuit. Moreover, the driver output provides a DC voltage bias for  the optical modulator without using a bias-T. The driver is measured with 3 dB bandwidth of 31.5 GHz and a data rate of 56 Gb/s PAM-4 with 3 Vpp output voltage swing 

AB - In this poster, an optical modulator driver which is designed for electronic and photonic wafer scale packaging is presented. By using the polymer adhesive bonding technique, Silicon ElectronicIntegrated Circuits (EICs) bond to the InP Photonic Integrated circuits (PICs) on the wafer scale. Small through polymer vias (TPVs) connect EICs to the PICs which reduces the parasitics and improves the maximum date rate. The presented optical modulator driver is designed for wafer scale packaging which optimizes the interface between PIC and EIC, result in a power efficient and high speed circuit. Moreover, the driver output provides a DC voltage bias for  the optical modulator without using a bias-T. The driver is measured with 3 dB bandwidth of 31.5 GHz and a data rate of 56 Gb/s PAM-4 with 3 Vpp output voltage swing 

M3 - Poster

ER -

Zhang X, Liu X, Matters-Kammerer MK. 56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging. 2018. Poster session presented at 2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018), Enschede, Netherlands.