48-Channel matrix optical transmitter on a single direct fiber connector

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

In this paper, 4 pairs of commercial 12-channel electronic and photonic dies have been assembled on a patterned wet etched silicon interposer for a terabit/s class optical interconnect. In the scheme, the optical dies are flip-chip bonded to form a 4 x 12 optical matrix with 250-μm pitch in both the x- and y-directions. A single compact optical connector, which is designed based on the commercial PRIZM MT ferrule, is employed to enable a single and direct connection of four fiber ribbons to all 48 channels. The alignment tolerance of the suggested optical connector is tested, and the best case loss is 1.0 dB. The electrical interface, for the connection of CMOS ICs and vertical-cavity surface-emitting laser dies, is designed and patterned on the silicon interposer. The process and assembly are also detailed. In performance testing, clear eye patterns for all the 48 channels are captured at 15 Gb/s with a pseudorandom bit stream 2³¹ patterns. The bit error rate curves of all the channels are recorded at 10 Gb/s and show a receiver sensitivity spread of less than 2.1 dB across all 48 channels at 10⁻¹² level. In addition, crosstalk effects are also characterized, showing a negligible power penalty of less than 0.2 dB. The fully assembled module can offer for the first time 0.72 Tb/s optical data output, within an area of 1.32 cm² by using low cost processes and commercially available dies.
LanguageEnglish
Pages3816 - 3822
Number of pages7
JournalIEEE Transactions on Electron Devices
Volume65
Issue number9
DOIs
StatePublished - 6 Aug 2018

Fingerprint

Fibers
Silicon
Naphazoline
Optical interconnects
Surface emitting lasers
Crosstalk
Bit error rate
Photonics
Optical transmitters
Testing
Costs
Direction compound

Keywords

    Cite this

    @article{65997faf89a34b87af28a7c3c7ad8412,
    title = "48-Channel matrix optical transmitter on a single direct fiber connector",
    abstract = "In this paper, 4 pairs of commercial 12-channel electronic and photonic dies have been assembled on a patterned wet etched silicon interposer for a terabit/s class optical interconnect. In the scheme, the optical dies are flip-chip bonded to form a 4 x 12 optical matrix with 250-μm pitch in both the x- and y-directions. A single compact optical connector, which is designed based on the commercial PRIZM MT ferrule, is employed to enable a single and direct connection of four fiber ribbons to all 48 channels. The alignment tolerance of the suggested optical connector is tested, and the best case loss is 1.0 dB. The electrical interface, for the connection of CMOS ICs and vertical-cavity surface-emitting laser dies, is designed and patterned on the silicon interposer. The process and assembly are also detailed. In performance testing, clear eye patterns for all the 48 channels are captured at 15 Gb/s with a pseudorandom bit stream 2³¹ patterns. The bit error rate curves of all the channels are recorded at 10 Gb/s and show a receiver sensitivity spread of less than 2.1 dB across all 48 channels at 10⁻¹² level. In addition, crosstalk effects are also characterized, showing a negligible power penalty of less than 0.2 dB. The fully assembled module can offer for the first time 0.72 Tb/s optical data output, within an area of 1.32 cm² by using low cost processes and commercially available dies.",
    keywords = "Optical device fabrication, Optical transmitters, Silicon, Integrated optics, Vertical cavity surface emitting lasers, Optical crosstalk, Optical interconnections, optoelectronic integration, silicon interposer",
    author = "C. Li and X. Zhang and T. Li and O. Raz and R. Stabile",
    year = "2018",
    month = "8",
    day = "6",
    doi = "10.1109/TED.2018.2859264",
    language = "English",
    volume = "65",
    pages = "3816 -- 3822",
    journal = "IEEE Transactions on Electron Devices",
    issn = "0018-9383",
    publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
    number = "9",

    }

    48-Channel matrix optical transmitter on a single direct fiber connector. / Li, C.; Zhang, X.; Li, T.; Raz, O.; Stabile, R.

    In: IEEE Transactions on Electron Devices, Vol. 65, No. 9, 06.08.2018, p. 3816 - 3822 .

    Research output: Contribution to journalArticleAcademicpeer-review

    TY - JOUR

    T1 - 48-Channel matrix optical transmitter on a single direct fiber connector

    AU - Li,C.

    AU - Zhang,X.

    AU - Li,T.

    AU - Raz,O.

    AU - Stabile,R.

    PY - 2018/8/6

    Y1 - 2018/8/6

    N2 - In this paper, 4 pairs of commercial 12-channel electronic and photonic dies have been assembled on a patterned wet etched silicon interposer for a terabit/s class optical interconnect. In the scheme, the optical dies are flip-chip bonded to form a 4 x 12 optical matrix with 250-μm pitch in both the x- and y-directions. A single compact optical connector, which is designed based on the commercial PRIZM MT ferrule, is employed to enable a single and direct connection of four fiber ribbons to all 48 channels. The alignment tolerance of the suggested optical connector is tested, and the best case loss is 1.0 dB. The electrical interface, for the connection of CMOS ICs and vertical-cavity surface-emitting laser dies, is designed and patterned on the silicon interposer. The process and assembly are also detailed. In performance testing, clear eye patterns for all the 48 channels are captured at 15 Gb/s with a pseudorandom bit stream 2³¹ patterns. The bit error rate curves of all the channels are recorded at 10 Gb/s and show a receiver sensitivity spread of less than 2.1 dB across all 48 channels at 10⁻¹² level. In addition, crosstalk effects are also characterized, showing a negligible power penalty of less than 0.2 dB. The fully assembled module can offer for the first time 0.72 Tb/s optical data output, within an area of 1.32 cm² by using low cost processes and commercially available dies.

    AB - In this paper, 4 pairs of commercial 12-channel electronic and photonic dies have been assembled on a patterned wet etched silicon interposer for a terabit/s class optical interconnect. In the scheme, the optical dies are flip-chip bonded to form a 4 x 12 optical matrix with 250-μm pitch in both the x- and y-directions. A single compact optical connector, which is designed based on the commercial PRIZM MT ferrule, is employed to enable a single and direct connection of four fiber ribbons to all 48 channels. The alignment tolerance of the suggested optical connector is tested, and the best case loss is 1.0 dB. The electrical interface, for the connection of CMOS ICs and vertical-cavity surface-emitting laser dies, is designed and patterned on the silicon interposer. The process and assembly are also detailed. In performance testing, clear eye patterns for all the 48 channels are captured at 15 Gb/s with a pseudorandom bit stream 2³¹ patterns. The bit error rate curves of all the channels are recorded at 10 Gb/s and show a receiver sensitivity spread of less than 2.1 dB across all 48 channels at 10⁻¹² level. In addition, crosstalk effects are also characterized, showing a negligible power penalty of less than 0.2 dB. The fully assembled module can offer for the first time 0.72 Tb/s optical data output, within an area of 1.32 cm² by using low cost processes and commercially available dies.

    KW - Optical device fabrication

    KW - Optical transmitters

    KW - Silicon

    KW - Integrated optics

    KW - Vertical cavity surface emitting lasers

    KW - Optical crosstalk

    KW - Optical interconnections

    KW - optoelectronic integration

    KW - silicon interposer

    U2 - 10.1109/TED.2018.2859264

    DO - 10.1109/TED.2018.2859264

    M3 - Article

    VL - 65

    SP - 3816

    EP - 3822

    JO - IEEE Transactions on Electron Devices

    T2 - IEEE Transactions on Electron Devices

    JF - IEEE Transactions on Electron Devices

    SN - 0018-9383

    IS - 9

    ER -