48 × 10-Gb/s cost-effective FPC-based on-board optical transmitter and receiver

Teng Li, Chenhui Li, Sander Dorrestein, Ripalta Stabile, Oded Raz

Research output: Contribution to journalArticleAcademicpeer-review

1 Citation (Scopus)
247 Downloads (Pure)


In this paper, we demonstrate a low-cost, 48-channel, high-speed, flexible printed circuit (FPC)-based interconnect packaging concept for on-board optical modules. Due to the good high-speed performance and low cost, the FPC board is used as the base carrier for both transmitter and receiver modules. The on-board transmitter and receiver are based on a commercial 1-mm-pitch ISI HoLi pin grid array connector. The size of each module is only 31.5 × 31.5 mm and offers a state-of-art bandwidth density of 0.483 Gb/s/mm 2 by using a compact design. Investigation of RF signal propagation on the FPC is carried out for design validation at 10 Gb/s and, in order to further explore the potential of the suggested platform, differential pairs are simulated up to 30 GHz. The low-cost packaging approach requires only several flip-chip bonding steps using industry-standard solder reflow and ultrasonic bonding processes. An 8 × 12 -channel optical straight lens connector is used to couple the light from the optics into two 48-fiber multi-fiber push on connectors with 8 × 12 -channel MT ferrules. The fully assembled transmitter and receiver are tested at 10 Gb/s demonstrating error-free operation with sensitivities comparable with those of commercial devices. Bit error rates for all 96 channels as well as representative eye diagrams at 10 Gb/s are reported.

Original languageEnglish
Article number8403273
Pages (from-to)1353-1362
Number of pages10
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number8
Publication statusPublished - Aug 2018


  • Circuit simulation
  • Connectors
  • Electronics packaging
  • Flexible printed circuits
  • High-speed optical techniques
  • Optical receivers
  • Optical transmitter and receiver
  • Optical transmitters
  • Packaging
  • Thermal analysis
  • electronics packaging
  • optical transmitter and receiver
  • flexible printed circuits (FPCs)
  • thermal analysis


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