400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer

Chenhui Li, Ripalta Stabile, Finn Kraemer, Teng Li, Oded Raz

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)

Abstract

In this paper, based on a wet etched silicon interposer, we propose a 2.5D assembly of two dimensional optical transceivers for 400 Gbps parallel optical interconnections. In this opto-electronic packaging, two dimensional optical matrix is formed as 250 μm in both the x -and y-directions by exploiting commercial opto-electronic arrays, and a compact optical interface is used to couple the light channels with fiber ribbons. Each quadrant of the optical matrix is connected with its CMOS IC part via impedance matched co-planner wave guides. The shortest traces between optics and CMOS ICs can be 300 μm, benefiting from flip-chip technology. The process flow of silicon interposer fabrication is illustrated. With flip-chip bonding, 25 Gbps 2D 16-channel receiver is assembled on the silicon interposer, and the sub-module, including the optical interface, is scaled down to 4 mm by 6 mm. In addition, the performance of this assembled module is fully characterized. Uniform and clear eye patterns are captured for all of the channels. Receiver sensitivities are also tested for all channels at 25.78 Gbps, 2 31-1 PRBS, with the variation less than 1.5 dB at error free operation.

LanguageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages848-853
Number of pages6
ISBN (Electronic)978-1-5386-4999-2
ISBN (Print)978-1-5386-5000-4
DOIs
StatePublished - 7 Aug 2018
Event68th IEEE Electronic Components and Technology Conference, (ECTC 2018) - San Diego, United States
Duration: 29 May 20181 Jun 2018
https://www.merckgroup.com/en/events/ectc-2018.html

Conference

Conference68th IEEE Electronic Components and Technology Conference, (ECTC 2018)
Abbreviated titleECTC2018
CountryUnited States
CitySan Diego
Period29/05/181/06/18
Internet address

Fingerprint

Optical receivers
Silicon
Optical transceivers
Naphazoline
Electronics packaging
Optical interconnects
Optics
Fabrication
Fibers

Keywords

  • 2-dimensional optical transceiver
  • 2.5D stacking
  • Optical interconnects
  • Silicon ineterposer

Cite this

Li, C., Stabile, R., Kraemer, F., Li, T., & Raz, O. (2018). 400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (pp. 848-853). [8429644] Institute of Electrical and Electronics Engineers (IEEE). DOI: 10.1109/ECTC.2018.00131
Li, Chenhui ; Stabile, Ripalta ; Kraemer, Finn ; Li, Teng ; Raz, Oded. / 400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer. Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers (IEEE), 2018. pp. 848-853
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Li, C, Stabile, R, Kraemer, F, Li, T & Raz, O 2018, 400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer. in Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018., 8429644, Institute of Electrical and Electronics Engineers (IEEE), pp. 848-853, 68th IEEE Electronic Components and Technology Conference, (ECTC 2018), San Diego, United States, 29/05/18. DOI: 10.1109/ECTC.2018.00131

400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer. / Li, Chenhui; Stabile, Ripalta; Kraemer, Finn; Li, Teng; Raz, Oded.

Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers (IEEE), 2018. p. 848-853 8429644.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Li C, Stabile R, Kraemer F, Li T, Raz O. 400 Gbps 2-Dimensional optical receiver assembled on wet etched silicon interposer. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers (IEEE). 2018. p. 848-853. 8429644. Available from, DOI: 10.1109/ECTC.2018.00131