3D thermal modelling of a fuse for the protection of semiconductors

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proc. International Power Engineering Conference
Pages	47-52
Publication status	Published - 1995
Event	conference; Proc. International Power Engineering Conference, Singapore, 15 February 1995 - Duration: 1 Jan 1995 → …

Conference	conference; Proc. International Power Engineering Conference, Singapore, 15 February 1995
Period	1/01/95 → …
Other	Proc. International Power Engineering Conference, Singapore, 15 February 1995

Cite this

@inproceedings{30661451314242319bd127aa85d13d3c,

title = "3D thermal modelling of a fuse for the protection of semiconductors",

author = "X.Z. Meng and \{Poll, van der\}, A. and J.G.J. Sloot and H. Rijanto",

year = "1995",

language = "English",

pages = "47--52",

booktitle = "Proc. International Power Engineering Conference",

note = "conference; Proc. International Power Engineering Conference, Singapore, 15 February 1995 ; Conference date: 01-01-1995",

}

TY - GEN

T1 - 3D thermal modelling of a fuse for the protection of semiconductors

AU - Meng, X.Z.

AU - Poll, van der, A.

AU - Sloot, J.G.J.

AU - Rijanto, H.

PY - 1995

Y1 - 1995

M3 - Conference contribution

SP - 47

EP - 52

BT - Proc. International Power Engineering Conference

T2 - conference; Proc. International Power Engineering Conference, Singapore, 15 February 1995

Y2 - 1 January 1995

ER -