Abstract
This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted by Advanced Packaging magazine. Participants were: Fred Roozeboom, Research Fellow, NXP Semiconductors and professor at TU Eindhoven; Kai Zoschke, Research Engineer for Fraunhofer IZM; and Thorsten Matthias, Director of Technology North America, EV Group
| Original language | English |
|---|---|
| Pages (from-to) | 1-5 |
| Journal | Advanced Packaging |
| Publication status | Published - 2008 |