3D packaging processes : part III

F. Roozeboom, K. Zoschke, T. Matthias

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This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted by Advanced Packaging magazine. Participants were: Fred Roozeboom, Research Fellow, NXP Semiconductors and professor at TU Eindhoven; Kai Zoschke, Research Engineer for Fraunhofer IZM; and Thorsten Matthias, Director of Technology North America, EV Group
Original languageEnglish
Pages (from-to)1-5
JournalAdvanced Packaging
Publication statusPublished - 2008


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