3D packaging of embeded opto-electronic die and CMOS IC based on wet etched silicon interposer

C. Li, E. Smalbrugge, T. Li, R. Stabile, O. Raz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

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Zwaartekracht ECO Research Centre for Integrated Nanophotonics
Koonen, A. M. J., Smit, M., Cao, Z., van der Heide, S., Shi, B., Spiegelberg, M., Raz, O., Al-Daffaie, S., Mukit, M., Shi, B. & Spiegelberg, M.
1/01/14 → 31/12/23
Project: Research direct