3D packaging of embeded opto-electronic die and CMOS IC based on wet etched silicon interposer

C. Li, E. Smalbrugge, T. Li, R. Stabile, O. Raz

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

5 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science