Projects per year
Abstract
Original language | English |
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Title of host publication | Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 551-556 |
Number of pages | 6 |
ISBN (Electronic) | 978-1-5090-6315-4 |
ISBN (Print) | 978-1-5090-6316-1 |
DOIs | |
Publication status | Published - 1 Aug 2017 |
Keywords
- 3D packaging
- Optical interconnects
- Silicon ineterposer
- Transceiver
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Dive into the research topics of '3D packaging of embeded opto-electronic die and CMOS IC based on wet etched silicon interposer'. Together they form a unique fingerprint.Projects
- 1 Finished
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Zwaartekracht ECO Research Centre for Integrated Nanophotonics
Koonen, A. M. J. (Project Manager), Smit, M. (Project member), Cao, Z. (Project member), van der Heide, S. (Project member), Shi, B. (Project member), Spiegelberg, M. (Project member), Raz, O. (Project Manager), Al-Daffaie, S. (Project member), Mukit, M. (Project member), Shi, B. (Project member), Spiegelberg, M. (Project member), Otupiri, R. (Project member), Raz, O. (Project Manager), Cao, Z. (Project member), Spiegelberg, M. (Project member), van der Heide, S. (Project member), Shi, B. (Project member), Smit, M. (Project member), Al-Daffaie, S. (Project member), Mukit, M. (Project member), Otupiri, R. (Project member) & Haasen, W. (Project member)
1/01/14 → 31/03/25
Project: First tier