3D-integrated multi-sensor demonstrator system for environmental monitoring

Anton Kock, Robert Wimmer-Teubenbacher, Florentyna Sosada-Ludwikovska, Karl Rohracher, Ewald Wachmann, Martin Herold, Ton van Welden, Jong Min Kim, Zeeshan Ali, Anneliese Poenninger, Markus Stahl-Offergeld, Hans Peter Hohe, Jurgen Lorenz, Tobias Erlbacher, Guido Dolmans, Peter Offermans, Marianne Vandecasteele, Olena Yurchenko, Oliver Von Sicard, Roland PohleFlorin Udrea, Claudio Falco, Denis Flandre, David Bol, Elisabetta Comini, Dario Zappa, Julian Gardner, Marina Cole, Jan Theunis, Jan Peters, Alan Baldwin

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.

Original languageEnglish
Title of host publication2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1136-1139
Number of pages4
ISBN (Electronic)978-1-5386-8104-6
DOIs
Publication statusPublished - 1 Jun 2019
Event20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany
Duration: 23 Jun 201927 Jun 2019

Conference

Conference20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
CountryGermany
CityBerlin
Period23/06/1927/06/19

Fingerprint

Sensor data fusion
Environmental Monitoring
environmental monitoring
Sensor
Monitoring
sensors
Sensors
Gas Sensor
System Integration
Optical Sensor
Intelligent buildings
Ultraviolet
Optical sensors
Chip
Infrared
platforms
Manufacturing
Chemical sensors
Integrate
Electronics

Keywords

  • 3D-System Integration
  • Heterogeneous Integration
  • Multi-Sensor Device
  • Multifunctional Nanomaterials
  • Smart Sensor System

Cite this

Kock, A., Wimmer-Teubenbacher, R., Sosada-Ludwikovska, F., Rohracher, K., Wachmann, E., Herold, M., ... Baldwin, A. (2019). 3D-integrated multi-sensor demonstrator system for environmental monitoring. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 1136-1139). [8808418] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/TRANSDUCERS.2019.8808418
Kock, Anton ; Wimmer-Teubenbacher, Robert ; Sosada-Ludwikovska, Florentyna ; Rohracher, Karl ; Wachmann, Ewald ; Herold, Martin ; van Welden, Ton ; Min Kim, Jong ; Ali, Zeeshan ; Poenninger, Anneliese ; Stahl-Offergeld, Markus ; Hohe, Hans Peter ; Lorenz, Jurgen ; Erlbacher, Tobias ; Dolmans, Guido ; Offermans, Peter ; Vandecasteele, Marianne ; Yurchenko, Olena ; Von Sicard, Oliver ; Pohle, Roland ; Udrea, Florin ; Falco, Claudio ; Flandre, Denis ; Bol, David ; Comini, Elisabetta ; Zappa, Dario ; Gardner, Julian ; Cole, Marina ; Theunis, Jan ; Peters, Jan ; Baldwin, Alan. / 3D-integrated multi-sensor demonstrator system for environmental monitoring. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Piscataway : Institute of Electrical and Electronics Engineers, 2019. pp. 1136-1139
@inproceedings{cb7af0c59f42404da5d71a4d20860bb8,
title = "3D-integrated multi-sensor demonstrator system for environmental monitoring",
abstract = "This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.",
keywords = "3D-System Integration, Heterogeneous Integration, Multi-Sensor Device, Multifunctional Nanomaterials, Smart Sensor System",
author = "Anton Kock and Robert Wimmer-Teubenbacher and Florentyna Sosada-Ludwikovska and Karl Rohracher and Ewald Wachmann and Martin Herold and {van Welden}, Ton and {Min Kim}, Jong and Zeeshan Ali and Anneliese Poenninger and Markus Stahl-Offergeld and Hohe, {Hans Peter} and Jurgen Lorenz and Tobias Erlbacher and Guido Dolmans and Peter Offermans and Marianne Vandecasteele and Olena Yurchenko and {Von Sicard}, Oliver and Roland Pohle and Florin Udrea and Claudio Falco and Denis Flandre and David Bol and Elisabetta Comini and Dario Zappa and Julian Gardner and Marina Cole and Jan Theunis and Jan Peters and Alan Baldwin",
year = "2019",
month = "6",
day = "1",
doi = "10.1109/TRANSDUCERS.2019.8808418",
language = "English",
pages = "1136--1139",
booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",

}

Kock, A, Wimmer-Teubenbacher, R, Sosada-Ludwikovska, F, Rohracher, K, Wachmann, E, Herold, M, van Welden, T, Min Kim, J, Ali, Z, Poenninger, A, Stahl-Offergeld, M, Hohe, HP, Lorenz, J, Erlbacher, T, Dolmans, G, Offermans, P, Vandecasteele, M, Yurchenko, O, Von Sicard, O, Pohle, R, Udrea, F, Falco, C, Flandre, D, Bol, D, Comini, E, Zappa, D, Gardner, J, Cole, M, Theunis, J, Peters, J & Baldwin, A 2019, 3D-integrated multi-sensor demonstrator system for environmental monitoring. in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII., 8808418, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1136-1139, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 23/06/19. https://doi.org/10.1109/TRANSDUCERS.2019.8808418

3D-integrated multi-sensor demonstrator system for environmental monitoring. / Kock, Anton; Wimmer-Teubenbacher, Robert; Sosada-Ludwikovska, Florentyna; Rohracher, Karl; Wachmann, Ewald; Herold, Martin; van Welden, Ton; Min Kim, Jong; Ali, Zeeshan; Poenninger, Anneliese; Stahl-Offergeld, Markus; Hohe, Hans Peter; Lorenz, Jurgen; Erlbacher, Tobias; Dolmans, Guido; Offermans, Peter; Vandecasteele, Marianne; Yurchenko, Olena; Von Sicard, Oliver; Pohle, Roland; Udrea, Florin; Falco, Claudio; Flandre, Denis; Bol, David; Comini, Elisabetta; Zappa, Dario; Gardner, Julian; Cole, Marina; Theunis, Jan; Peters, Jan; Baldwin, Alan.

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Piscataway : Institute of Electrical and Electronics Engineers, 2019. p. 1136-1139 8808418.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - 3D-integrated multi-sensor demonstrator system for environmental monitoring

AU - Kock, Anton

AU - Wimmer-Teubenbacher, Robert

AU - Sosada-Ludwikovska, Florentyna

AU - Rohracher, Karl

AU - Wachmann, Ewald

AU - Herold, Martin

AU - van Welden, Ton

AU - Min Kim, Jong

AU - Ali, Zeeshan

AU - Poenninger, Anneliese

AU - Stahl-Offergeld, Markus

AU - Hohe, Hans Peter

AU - Lorenz, Jurgen

AU - Erlbacher, Tobias

AU - Dolmans, Guido

AU - Offermans, Peter

AU - Vandecasteele, Marianne

AU - Yurchenko, Olena

AU - Von Sicard, Oliver

AU - Pohle, Roland

AU - Udrea, Florin

AU - Falco, Claudio

AU - Flandre, Denis

AU - Bol, David

AU - Comini, Elisabetta

AU - Zappa, Dario

AU - Gardner, Julian

AU - Cole, Marina

AU - Theunis, Jan

AU - Peters, Jan

AU - Baldwin, Alan

PY - 2019/6/1

Y1 - 2019/6/1

N2 - This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.

AB - This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.

KW - 3D-System Integration

KW - Heterogeneous Integration

KW - Multi-Sensor Device

KW - Multifunctional Nanomaterials

KW - Smart Sensor System

UR - http://www.scopus.com/inward/record.url?scp=85071922589&partnerID=8YFLogxK

U2 - 10.1109/TRANSDUCERS.2019.8808418

DO - 10.1109/TRANSDUCERS.2019.8808418

M3 - Conference contribution

AN - SCOPUS:85071922589

SP - 1136

EP - 1139

BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Kock A, Wimmer-Teubenbacher R, Sosada-Ludwikovska F, Rohracher K, Wachmann E, Herold M et al. 3D-integrated multi-sensor demonstrator system for environmental monitoring. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Piscataway: Institute of Electrical and Electronics Engineers. 2019. p. 1136-1139. 8808418 https://doi.org/10.1109/TRANSDUCERS.2019.8808418