3D-integrated multi-sensor demonstrator system for environmental monitoring

Anton Kock, Robert Wimmer-Teubenbacher, Florentyna Sosada-Ludwikovska, Karl Rohracher, Ewald Wachmann, Martin Herold, Ton van Welden, Jong Min Kim, Zeeshan Ali, Anneliese Poenninger, Markus Stahl-Offergeld, Hans Peter Hohe, Jurgen Lorenz, Tobias Erlbacher, Guido Dolmans, Peter Offermans, Marianne Vandecasteele, Olena Yurchenko, Oliver Von Sicard, Roland PohleFlorin Udrea, Claudio Falco, Denis Flandre, David Bol, Elisabetta Comini, Dario Zappa, Julian Gardner, Marina Cole, Jan Theunis, Jan Peters, Alan Baldwin

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.

Original languageEnglish
Title of host publication2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1136-1139
Number of pages4
ISBN (Electronic)978-1-5386-8104-6
DOIs
Publication statusPublished - 1 Jun 2019
Event20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany
Duration: 23 Jun 201927 Jun 2019

Conference

Conference20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
CountryGermany
CityBerlin
Period23/06/1927/06/19

Keywords

  • 3D-System Integration
  • Heterogeneous Integration
  • Multi-Sensor Device
  • Multifunctional Nanomaterials
  • Smart Sensor System

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