3-D analysis of heat transfer intensification by pin-fins with a highly thermal conductive plate

Q. Wang; V. Hessel; E. Rebrov

3-D analysis of heat transfer intensification by pin-fins with a highly thermal conductive plate

Q. Wang, V. Hessel, E. Rebrov

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

Abstract

Poster presentation - no abstract.

Original language	English
Title of host publication	Netherlands Process Technology Symposium (NPS-10)
Place of Publication	Veldhoven
Pages	1-
Publication status	Published - 2010
Event	Netherlands Process Technology Meeting (NPS-10) Veldhoven, The Netherlands, October 25-27 2010. - Duration: 25 Oct 2010 → 27 Oct 2010

Conference

Conference	Netherlands Process Technology Meeting (NPS-10) Veldhoven, The Netherlands, October 25-27 2010.
Period	25/10/10 → 27/10/10
Other	Netherlands Process Technology Symposium (NPS-10)

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@inproceedings{35c73a5c85ad483aa6dfe714e740e088,

title = "3-D analysis of heat transfer intensification by pin-fins with a highly thermal conductive plate",

abstract = "Poster presentation - no abstract.",

author = "Q. Wang and V. Hessel and E. Rebrov",

year = "2010",

language = "English",

pages = "1--",

booktitle = "Netherlands Process Technology Symposium (NPS-10)",

note = "Netherlands Process Technology Meeting (NPS-10) Veldhoven, The Netherlands, October 25-27 2010. ; Conference date: 25-10-2010 Through 27-10-2010",

}

TY - GEN

T1 - 3-D analysis of heat transfer intensification by pin-fins with a highly thermal conductive plate

AU - Wang, Q.

AU - Hessel, V.

AU - Rebrov, E.

PY - 2010

Y1 - 2010

N2 - Poster presentation - no abstract.

AB - Poster presentation - no abstract.

M3 - Conference contribution

SP - 1-

BT - Netherlands Process Technology Symposium (NPS-10)

CY - Veldhoven

T2 - Netherlands Process Technology Meeting (NPS-10) Veldhoven, The Netherlands, October 25-27 2010.

Y2 - 25 October 2010 through 27 October 2010

ER -

3-D analysis of heat transfer intensification by pin-fins with a highly thermal conductive plate

Abstract

Conference

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Cite this