Abstract
High-precision positioning systems, such as lithography wafer scanners, vibration isolators and gravity compensation systems require multi-DoF stages. These stages generally apply magnetic actuators because of their contactless operation and high-force capacity. The working range of current magnetic actuators in the levitating direction is limited to around 1mm [1]. However, in some applications such as wafer loading in nanoimprint lithography, a long-stroke motion is required. Although increasing the airgap width would increase the working range, it would also require a larger driving current and, thus, more heat dissipation, which is undesirable for high-precision systems. To alleviate this problem, the design of a novel 2-DoF magnetic actuator is presented in this paper. The actuator, presented in Section 1, is capable of both long-stroke (20mm) and short-stroke (2mm) motions in two perpendicular axes. In the long-stroke direction the actuator can achieve high-precision positioning with low power and a tuneable constant force, which is confirmed both by simulation and experiments. In the short-stroke direction, it works as a conventional reluctance actuator. Moreover, as shown in Section 2, the actuator could also be used to design 6-DoF maglev positioning stages with gravity compensation (see Figure 1).
Original language | English |
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Title of host publication | Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 |
Editors | R. Leach, Paul Shore |
Publisher | European Society for Precision Engineering and Nanotechnology |
Pages | 279-282 |
Number of pages | 4 |
ISBN (Electronic) | 9780956679024 |
Publication status | Published - 2013 |
Externally published | Yes |
Event | 13th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN 2013) - Berlin, Germany Duration: 27 May 2013 → 31 May 2013 |
Conference
Conference | 13th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN 2013) |
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Abbreviated title | EUSPEN |
Country/Territory | Germany |
City | Berlin |
Period | 27/05/13 → 31/05/13 |