1/f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment

L.K.J. Vandamme, M.G. Perichaud, E. Noguera, Y. Danto, U. Behner

Research output: Contribution to journalArticleAcademicpeer-review

2 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science

Physics & Astronomy