1/f Noise as a diagnostic tool to investigate the quality of anisotropic donductive adhesive (ACA) bonds for ball grid arrays (BGA's)

Engineering

• Constriction Resistance 50%
• Aging 33%
• Temperature 33%
• Reduction 33%
• Electrical Contact 33%
• Adhesive Bond 33%
• Models 16%
• Measurement 16%
• Reliability 16%
• Fluctuations 16%
• Anisotropic 16%
• Conductance 16%
• Relative Humidity 16%
• Noise Analysis 16%
• Reliability Assessment 16%
• Conductive Adhesive 16%
• Ball Grid Arrays 16%
• Humidity Test 16%

Physics

• Temperature 50%
• Degradation 50%
• Quality 33%
• Model 16%
• Information 16%
• Reliability 16%
• Arrays 16%
• Moisture Content 16%

Material Science

• Contact Area 100%
• Aging of Materials 33%
• Characterization 16%
• Stress Analysis 16%