In the semiconductor industry, Scanning Electron Microscopy or SEMs are used for defect inspection and measuring the spatial lateral dimensions of structures on a microchip. Although SEM is the fastest non-destructive and local measurement technique at present, the current SEM systems do not offer the ability to perform 3D measurements of the wafer surface. In practice, detailed metrology that provides the true 3D geometry is crucial to reach higher nanometer precision in microchip fabrication. This project will focus on developing innovative techniques for establishing such 3D metrology by employing artificial intelligence techniques which will result in state-of-the-art 3D reconstruction learning.
|Effective start/end date||1/01/20 → 30/09/25|
Funded in part by
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