Event title | International Wafer-Level Packaging Conference |
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Location | Doubletree Hotel by Hilton San Jose, San Jose, CA, United StatesShow on map |
Period | 23 Oct 2018 → 25 Oct 2018 |
Best Paper Award International Wafer-Level Packaging Conference 2018
- Podpod, Arnita (Recipient), Velenis, Dimitrios (Recipient), Phommahaxay, Alain (Recipient), Bex, Pieter (Recipient), Fodor, Ferenc (Recipient), Marinissen, Erik Jan (Recipient), Rebibis, Kenneth June (Recipient), Miller, Andy (Recipient), Beyer, Gerald (Recipient) & Beyne, Eric (Recipient)
Prize: Other › Career, activity or publication related prizes (lifetime, best paper, poster etc.) › Scientific