Best 3D Track Paper at International Wafer-Level Packaging Conference 2018

  • Arnita Podpod (Recipient), Dimitrios Velenis (Recipient), Alain Phommahaxay (Recipient), Pieter Bex (Recipient), Ferenc Fodor (Recipient), Marinissen, Erik Jan (Recipient), Kenneth June Rebibis (Recipient), Andy Miller (Recipient), Gerald Beyer (Recipient) & Eric Beyne (Recipient)

Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

Description

Arnita Podpod, Dimitrios Velenis, Alain Phommahaxay, Pieter Bex, Ferenc Fodor, Erik Jan Marinissen, Kenneth June Rebibis, Andy Miller, Gerald Beyer, and Eric Beyne, 'High Density and High Bandwidth Chip-to-Chip Connections with 20µm Pitch Flip-Chip on Fan-Out Wafer Level Package', International Wafer-Level Packaging Conference (IWLPC'18), San Jose, CA, USA, October 2018, doi: http://doi.org/10.23919/IWLPC.2018.8573262
Degree of recognitionInternational
Granting OrganisationsInternational Wafer-Level Packaging Conference (IWLPC)

Awarded at event

Event titleInternational Wafer-Level Packaging Conference
LocationDoubletree Hotel by Hilton San Jose, San Jose, CA, United States
Period23 Oct 2018 → 25 Oct 2018

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