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Yifei Chang received the M.S. degree from FudanUniversity, Shanghai, China, in 2025, where he focused on the design of siliconcarbide (SiC) power devices. In 2025, he served as a research intern at the EATON, Shanghai. He is currently pursuing the Ph.D. degree with the Electromechanics and Power Electronics Group at Eindhoven University of Technology, the Netherlands. His research interests include the design and condition monitoring of high-performance medium-voltage power converters, as well as device-level reliability.
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy
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Collaborations and top research areas from the last five years
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Comparative Analysis of Short-Circuit Behavior and Failure Mechanisms in Planar and Trench-Gate SiC MOSFETs
Chang, Y., Li, C., Tang, J., Guan, H., Zhang, Q. J. & Liu, P., 14 May 2026, (Accepted/In press) In: IEEE Journal of Emerging and Selected Topics in Power Electronics. XXResearch output: Contribution to journal › Article › Academic › peer-review
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Electroluminescence-based Junction Temperature Sensing Under Realistic Switching Conditions
Stathatos, A. (Corresponding author), Chang, Y., Papafotiou, G. & Li, C., 4 Aug 2026, In: IEEE Open Journal of Power Electronics. 7, p. 2314-2326 13 p., 11641002.Research output: Contribution to journal › Article › Academic › peer-review
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Improving Thermal Resilience of SiC Power Converters: From Device Design, Packaging to Temperature Monitoring and Active Thermal Management
Chang, Y., Acosta Brito, I. A., Zhang, K., Stathatos, A., Lee, J. & Li, C., 8 Sept 2026, (Accepted/In press) In: Chinese Journal of Electrical Engineering. XXResearch output: Contribution to journal › Article › Academic › peer-review
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Investigation of Degradation Mechanism in 1200-V SiC MOSFETs Under Surge Current Stress of Body Diode Using Electro-Thermal-Mechanical Analysis
Guan, H., Chang, Y., Bai, P., Bian, L., Zhang, Q. J. & Liu, P., Jun 2026, In: IEEE Journal of Emerging and Selected Topics in Power Electronics. 14, 3, p. 3278-3288 11 p., 11397631.Research output: Contribution to journal › Article › Academic › peer-review
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Simulation, Verification, and Failure Analysis of Fast Recovery Diodes for the Surge Current Capability
Guan, H., Chang, Y., Qi, L. & Liu, P., 11 Mar 2025, 2024 IEEE 26th Electronics Packaging Technology Conference, EPTC 2024. Institute of Electrical and Electronics Engineers, 6 p. 10909923Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review