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Content available in repository
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2024
IndustReal: A Dataset for Procedure Step Recognition Handling Execution Errors in Egocentric Videos in an Industrial-Like Setting
Schoonbeek, T. J., Houben, T., Onvlee, H., de With, P. H. N. & van der Sommen, F., 9 Apr 2024, 2024 IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2024. Institute of Electrical and Electronics Engineers, p. 4353-4362 10 p. 10484389Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
Open Access -
Proceedings of the Workshop on 3D Geometry Generation for Scientific Computing
Ramirez de Chanlatte, M., Colella, P., Darrell, T., Carlson, A. K., de With, P. H. N., Deng, H., Guan, S., Hays, J., Houben, T., Huisman, T., Jaipuria, N., Johansen, H., Khalid, S., Krishnan, A., Li, C., Pisarenco, M., Raj, A., Rudzicz, F., Schoonbeek, T. J. & Sridhar, S. & 9 others, , 16 Apr 2024, 2024 IEEE Winter Conference on Applications of Computer Vision Workshops, WACVW 2024. Institute of Electrical and Electronics Engineers, p. 762-766 5 p. 10495682Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
File46 Downloads (Pure) -
2023
A multi-wafer case study for 3D geometry prediction of FinFET-like structures with top-down SEM imaging
Houben, T., Huisman, T. J., Pisarenco, M., van der Sommen, F. & de With, P. H. N., 14 Sept 2023, International Microscopy Congress (IMC20).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
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Depth estimation from SEM images using deep learning and angular data diversity
Houben, T., Pisarenco, M., Huisman, T., Onvlee, H., Sommen, F. V. D. & de With, P., 27 Apr 2023, Metrology, Inspection, and Process Control XXXVII. Robinson, J. C. & Sendelbach, M. J. (eds.). SPIE, p. 1-9 9 p. 124961E. (Proceedings of SPIE; vol. 12496).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
1 Citation (Scopus) -
Probing EUV resist defect detectability using a SEM simulation framework
Wallow, T. I., Jiang, A., Kiers, T., Houben, T. & Spence, C., 22 Nov 2023, Probing EUV resist defect detectability using a SEM simulation framework. Naulleau, P. P., Gargini, P. A., Itani, T. & Ronse, K. G. (eds.). SPIE, (Proceedings of SPIE; vol. PC12750).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Professional
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2022
Depth Estimation from a Single CD-SEM Image Using Domain Adaptation with Multimodal Data
Houben, T., Huisman, T., Pisarenco, M., van der Sommen, F. & de With, P., 2022, Fourteenth International Conference on Machine Vision, ICMV 2021. Osten, W., Nikolaev, D. & Zhou, J. (eds.). SPIE, p. 1-9 9 p. 120841I. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12084).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
1 Downloads (Pure) -
2019
Quality assessment of transperineal ultrasound images of the male pelvic region using deep learning
Camps, S., Houben, T., Edwards, C., Antico, M., Dunnhofer, M., Martens, E., Baeza, J., Vanneste, B., van Limbergen, E., de With, P., Verhaegen, F., Carneiro, G. & Fontanarosa, D., 25 Feb 2019, 2018 IEEE International Ultrasonics Symposium (IUS). Piscataway: Institute of Electrical and Electronics Engineers, 4 p. 8579839Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
1 Citation (Scopus)