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Research profile

Olaf van der Sluis is an Associate Professor and chair of Failure Mechanics of Microelectronic Devices in the Mechanics of Materials group at the Eindhoven University of Technology (TU/e) Department of Mechanical Engineering. His research interests include fracture mechanics, mechanics and adhesion of thin films, multi-scale mechanics, and lifetime prediction of microelectronic devices (rigid, flexible, and stretchable). The goal is two-fold: (1) identify and understand the most relevant failure phenomena that govern the complex behaviour of devices during processing, qualification and usage; (2) support and accelerate the design of functional and structurally robust products.

Academic background

Olaf van der Sluis obtained his PhD in continuum-based multi-scale modelling of materials in 2001 at TU/e. Between 2008 and 2009, he was part-time Assistant Professor at Delft University of Technology. In 2010, he was appointed Assistant Professor at the Mechanics of Materials group at TU/e, and in 2015 he became part-time Associate Professor in the same group.

These research topics are motivated by his industrial position at Philips. In 2001, he joined Philips CFT (which became Philips Applied Technologies in 2005) working on various topics such as non-local ductile damage material models and computational homogenisation for metal forming processes, as well as fracture mechanics and lifetime prediction of microelectronics devices. In 2011, he joined Philips Research as a senior scientist. Here, he has been working on computational modelling of critical failure mechanisms in medical devices and imaging systems, in order to understand and predict lifetime and optimise reliability through a combination of numerical and experimental tools.

He was involved in or in charge of several EU-funded research projects and serves as an expert evaluator for the European Commission. He is a reviewer of 26 international scientific journals. Olaf van der Sluis received the Philips Research Outstanding Achievement Award 2017.

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  • 3 Similar Profiles
Delamination Engineering & Materials Science
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Adhesion Engineering & Materials Science
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Rubber Engineering & Materials Science
Microelectronics Engineering & Materials Science
Adhesives Engineering & Materials Science
Sheet molding compounds Engineering & Materials Science

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Research Output 1995 2019

An in-situ, micro-mechanical setup with accurate, tri-axial, piezoelectric force sensing and positioning

Ruybalid, A. P., Hoefnagels, J. P. M., van der Sluis, O. & Geers, M. G. D., 18 Dec 2019, (Accepted/In press) In : Experimental Mechanics.

Research output: Contribution to journalArticleAcademicpeer-review

Piezoelectric actuators
Force measurement
Displacement measurement
Mechanical testing
Organic light emitting diodes (OLED)
2 Citations (Scopus)
2 Downloads (Pure)

Mixed-mode cohesive zone parameters from integrated digital image correlation on micrographs only

Ruybalid, A. P., Hoefnagels, J. P. M., van der Sluis, O., van Maris, M. P. F. H. L. & Geers, M. G. D., 1 Jan 2019, In : International Journal of Solids and Structures. 156-157, p. 179-193 15 p.

Research output: Contribution to journalArticleAcademicpeer-review

Cohesive Zone
Mixed Mode
Digital Image
Cohesive Zone Model
Virtual Experiment
49 Downloads (Pure)

A bulge test based methodology for characterizing ultra-thin buckled membranes

Shafqat, S., van der Sluis, O., Geers, M. G. D. & Hoefnagels, J. P. M., 9 Apr 2018, In : Thin Solid Films. 660, p. 88-100 13 p.

Research output: Contribution to journalArticleAcademicpeer-review

Open Access
File
ripples
methodology
membranes
Membranes
curvature
1 Citation (Scopus)

Advances in delamination modeling of metal/polymer systems: atomistic aspects

van der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., van Driel, W. D. & Zhang, K., 1 Sep 2018, Nanopackaging: nanotechnologies and electronics packaging. Morris, J. (ed.). 2 ed. Dordrecht: Springer, p. 129-183 55 p.

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

Delamination
Polymers
Adhesion
Metals
Sheet molding compounds
2 Citations (Scopus)

Advances in delamination modeling of metal/polymer systems: continuum aspects

van der Sluis, O., Vossen, B. G., Neggers, J., Ruybalid, A. P., Chockalingam, K., Peerlings, R. H. J., Hoefnagels, J. P. M., Remmers, J. J. C., Kouznetsova, V., Schreurs, P. J. G. & Geers, M. G. D., 1 Sep 2018, Nanopackaging: nanotechnologies and electronics packaging. Morris, J. (ed.). Dordrecht: Springer, p. 83-128 46 p.

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

delamination
adhesion
polymer
metal
modeling

Courses

Student theses

Analytical homogenization of 3D printed unidirectional microstructures

Author: Deen, I., 26 May 2016

Supervisor: Peerlings, R. (Supervisor 1) & van der Sluis, O. (Supervisor 2)

Student thesis: Master

An analytical-experimental approach for interface characterization using integrated DIC

Author: Baan, M., 31 Jan 2015

Supervisor: Hoefnagels, J. (Supervisor 1) & van der Sluis, O. (Supervisor 2)

Student thesis: Master

Characterization and modeling of interfacial adhesion for semiconductor applications covering the full range of mode mixity

Author: Thijsse, J., 30 Jun 2006

Supervisor: Geers, M. (Supervisor 1), van Dommelen, J. (Supervisor 2), Luijten, C. (Supervisor 2), Hoefnagels, J. (Supervisor 2), van der Sluis, O. (External coach) & van Driel, W. (External coach)

Student thesis: Master

Effect of residual stress on the delamination of film-substrate systems under bending

Author: Forschelen, P., 31 Mar 2015

Supervisor: Suiker, A. (Supervisor 1), van der Sluis, O. (Supervisor 2) & Hofmeyer, H. (Supervisor 2)

Student thesis: Master

File

Homogenization of heterogeneous polymers towards Cosserat media

Author: van der Sluis, O., 30 Jun 1996

Supervisor: Meijer, H. (Supervisor 1), Vosbeek, P. (Supervisor 2), Schreurs, P. (Supervisor 2) & Smit, R. (Supervisor 2)

Student thesis: Master

File