Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy
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Dive into the research topics where Marc Spiegelberg is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Projects
- 1 Finished
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Zwaartekracht ECO Research Centre for Integrated Nanophotonics
Koonen, A. M. J. (Project Manager), Smit, M. (Project member), Cao, Z. (Project member), van der Heide, S. (Project member), Shi, B. (Project member), Spiegelberg, M. (Project member), Raz, O. (Project Manager), Al-Daffaie, S. (Project member), Mukit, M. (Project member), Shi, B. (Project member), Spiegelberg, M. (Project member), Otupiri, R. (Project member), Raz, O. (Project Manager), Cao, Z. (Project member), Spiegelberg, M. (Project member), van der Heide, S. (Project member), Shi, B. (Project member), Smit, M. (Project member), Al-Daffaie, S. (Project member), Mukit, M. (Project member), Otupiri, R. (Project member) & Haasen, W. (Project member)
1/01/14 → 15/08/25
Project: First tier
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Compact OWC Receiver: Micro-Lens and PD Array on Glass Interposer
Song, Y. (Corresponding author), Wolny, M., Li, C. (Corresponding author), Mekonnen, K. A., Correa, C. R. B., Spiegelberg, M., Tangdiongga, E. & Raz, O., 1 Dec 2023, In: Journal of Lightwave Technology. 41, 23, p. 7169-7176 8 p.Research output: Contribution to journal › Article › Academic › peer-review
Open AccessFile5 Link opens in a new tab Citations (Scopus)409 Downloads (Pure) -
Novel wafer-scale adhesive bonding with improved alignment accuracy and bond uniformity
Abdi, S. (Corresponding author), de Vries, T., Spiegelberg, M., Williams, K. A. & Jiao, Y., 1 Feb 2023, In: Microelectronic Engineering. 270, 7 p., 111936.Research output: Contribution to journal › Article › Academic › peer-review
Open AccessFile9 Link opens in a new tab Citations (Scopus)605 Downloads (Pure) -
Wafer-scale adhesive bonding with hard Benzocyclobutene anchors for wafer assembly and heterogeneous integration
Abdi, S., de Vries, T., Spiegelberg, M., Williams, K. & Jiao, Y., 12 May 2023, 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023. Institute of Electrical and Electronics Engineers, 4 p. 10121131Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
Open AccessFile3 Link opens in a new tab Citations (Scopus)81 Downloads (Pure) -
Compact OWC Receiver Enabled by Co-integration of Micro-Lens and PD Arrays on Glass Interposer
Song, Y., Li, C., Mekonnen, K. A., Wolny, M., Ribeiro Barbio Correa, C., Spiegelberg, M., Tangdiongga, E. & Raz, O., 29 Dec 2022, 2022 IEEE International Topical Meeting on Microwave Photonics, MWP 2022 - Proceedings. Institute of Electrical and Electronics Engineers, 4 p. 9997772Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
6 Downloads (Pure) -
3D-Integration on Wafer Level of Photonic and Electronic Circuits
Spiegelberg, M., 2 Mar 2021, Eindhoven: Technische Universiteit Eindhoven. 113 p.Research output: Thesis › Phd Thesis 1 (Research TU/e / Graduation TU/e)
Open AccessFile1141 Downloads (Pure)