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Personal profile


“A sustainable society requires durable materials and material systems, in which the damage and failure mechanisms that act at the microscale are understood and controlled.”

Research profile

Johan Hoefnagels is an Associate Professor in the Eindhoven University of Technology (TU/e) group Mechanics of Materials at Mechanical Engineering, following his earlier background in applied plasma physics and advanced optical diagnostics. His current research focuses on experimental micromechanics of ‘thin films and interfaces’, by studying the systems’ micro-mechanics through integration of mechanical-microscopic characterization of underlying micro-mechanisms, such as damage and fracture, and integrate coupling of numerical simulations to experimental procedures. Topics of particular interest include delamination, ductile damage, size effects, flexible and stretchable electronics and MEMS. One of Johan’s research projects involves investigating a revolutionary mechanism to make electronics extremely stretchable and demonstrating this by means of an inflatable, in-vivo ultrasound detector, for which the first key step has been achieved: a free-standing interconnect has been designed that can be elastically stretched beyond 2000% and cyclically stretched at 1000% for over 10 million times. 

Academic background

Johan Hoefnagels obtained his MSc and PhD in Applied Physics at TU/e, with a PhD thesis on advanced optical diagnostics of surface processes during thin film deposition. After his PhD he made a dramatic switch to become assistant professor in ‘experimental micromechanics’ at the department of mechanical engineering, where he later became associate professor in the same field. He leads the ‘Multi-Scale lab’ dedicated to ‘integrated mechanical testing’, which is one of TU/e’s 10 strategic labs.

Till 2018, Johan has (co-)authored ~75 journal publications (of which ~45 times as corresponding author) and >100 refereed proceedings/book contributions. At international conferences, has given >100 presentations, of which around a third on invitation, and organized 10 symposia. He has built up >2 years of international research experience during international visits to, amongst others, IMEC (Leuven, Belgium), SUNY (Albany, USA), NIST (Gaithersburg, USA), CSM (Golden, USA), and Harvard University (Cambridge, USA). And he holds, among others, the positions of Associate Editor of scientific Journal ‘Strain’ (impact factor 1.7) and Dutch representative of the European Structural Integrity Society.

Affiliated with

Partners in (semi-)industry

  • Philips Research / Lighting / DAP / Lumileds
  • Tata
  • Océ
  • Holst Centrum
  • TNO
  • NXP
  • ASML
  • Ramlab
  • Cirrus Logic
  • Sabic
  • IMEC
  • M2i
  • and others

Education/Academic qualification





American Vacuum Society

American Vacuum Society

State University of New York (SUNY)

Eindhoven University of Technology

Fingerprint Dive into the research topics where Johan P.M. Hoefnagels is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Research Output 1999 2020

6 Citations (Scopus)
5 Downloads (Pure)

Demonstrating the potential of accurate absolute cross-grain stress and orientation correlation using electron backscatter diffraction

Vermeij, T., De Graef, M. & Hoefnagels, J., 15 Mar 2019, In : Scripta Materialia. 162, p. 266-271 6 p.

Research output: Contribution to journalArticleAcademicpeer-review

Electron diffraction
diffraction patterns
electron counters
Crystal orientation
Diffraction patterns
11 Citations (Scopus)
2 Downloads (Pure)

Ferrite slip system activation investigated by uniaxial micro-tensile tests and simulations

Du, C., Maresca, F., Geers, M. G. D. & Hoefnagels, J. P. M., 1 Mar 2018, In : Acta Materialia. 146, p. 314-327 14 p.

Research output: Contribution to journalArticleAcademicpeer-review

Chemical activation
12 Citations (Scopus)
154 Downloads (Pure)

Retardation of plastic instability via damage-enabled micro-strain delocalization

Hoefnagels, J. P. M., Tasan, C. C., Maresca, F., Peters, F. J. & Kouznetsova, V., 2015, In : Journal of Materials Science. 50, 21, p. 6682-6897 16 p.

Research output: Contribution to journalArticleAcademicpeer-review

Open Access
28 Citations (Scopus)

Copper–rubber interface delamination in stretchable electronics

Hoefnagels, J. P. M., Neggers, J., Timmermans, P. H. M., Sluis, van der, O. & Geers, M. G. D., 2010, In : Scripta Materialia. 63, 8, p. 875-878

Research output: Contribution to journalArticleAcademicpeer-review

Electronic equipment
24 Citations (Scopus)
3 Downloads (Pure)

Processing induced size effects in plastic yielding upon miniaturisation

Janssen, P. J. M., Hoefnagels, J. P. M., de Keijser, T. H. & Geers, M. G. D., 2008, In : Journal of the Mechanics and Physics of Solids. 56, 8, p. 2687-2706

Research output: Contribution to journalArticleAcademicpeer-review

plastic deformation
laser cutting



Dorothy Hoffman Travel Award, 48th AVS Symposium, San Francisco

Johan P.M. Hoefnagels (Recipient), 2001

Prize: OtherScholarshipsScientific

strain measurement
plastic properties

RUBICON personal grant

Johan P.M. Hoefnagels (Recipient), 2005

Prize: NWORubiconScientific


Student theses

An analytical-experimental approach for interface characterization using integrated DIC

Author: Baan, M., 31 Jan 2015

Supervisor: Hoefnagels, J. (Supervisor 1) & van der Sluis, O. (Supervisor 2)

Student thesis: Master

A novel pure bending test methodology for the investigation of mechanical failure behavior of flexible electronics

Author: Ruybalid, A., 31 Mar 2013

Supervisor: Hoefnagels, J. (Supervisor 1), Geers, M. (Supervisor 2), Bouten, P. C. (External person) (External coach) & van Breemen, L. (Supervisor 2)

Student thesis: Master

Cavity ringdown study of the densities and kinetics of SiHx radicals in a remote SiH4 plasma

Author: Hoefnagels, J., 31 Aug 2000

Supervisor: Kessels, W. (Supervisor 1), Boogaarts, M. G. (External person) (Supervisor 2), van de Sanden, M. (Supervisor 2) & Schram, D. (Supervisor 2)

Student thesis: Master


Characterization and modeling of interfacial adhesion for semiconductor applications covering the full range of mode mixity

Author: Thijsse, J., 30 Jun 2006

Supervisor: Geers, M. (Supervisor 1), van Dommelen, J. (Supervisor 2), Luijten, C. (Supervisor 2), Hoefnagels, J. (Supervisor 2), van der Sluis, O. (External coach) & van Driel, W. (External coach)

Student thesis: Master