• 3331
    Citations - based on content available in repository [source: Scopus]
19992024

Content available in repository

Personal profile

Quote

“A sustainable society requires durable materials and material systems, in which the damage and failure mechanisms that act at the microscale are understood and controlled.”

Research profile

Johan Hoefnagels is Associate Professor in the section Mechanics of Materials at the department Mechanical Engineering of the Eindhoven University of Technology (TU/e). His research in the field of 'experimental micromechanics' focuses on unraveling the mechanics of a material system on the micronscale by integration of micro-mechanical testing with microscopic characterization and integration of experiments with numerical simulations. Topics of particular interest include delamination, ductile damage, size effects, flexible and stretchable electronics and MEMS.  

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- view here Johan's resume

Academic background

Johan Hoefnagels obtained his MSc and PhD in Applied Physics at TU/e, with a PhD thesis on advanced optical diagnostics of surface processes during thin film deposition. After his PhD he made a dramatic switch to become assistant professor in the field of ‘experimental micromechanics’ at the department of mechanical engineering, where he later became associate professor and head of his research group. He leads the ‘Multi-Scale lab’ dedicated to ‘integrated mechanical testing’, which is one of the 10 strategic labs of the TU/e.

Johan has (co-)authored >100 journal publications (of which ~50% as corresponding author) and >100 refereed proceedings/book contributions. At international conferences, has given >120 presentations, of which around a third on invitation, and organized over 10 symposia. He has over two years of international research experience, built up during international visits to, amongst others, IMEC (Leuven, Belgium), SUNY (Albany, USA), NIST (Gaithersburg, USA), CSM (Golden, USA), and Harvard University (Cambridge, USA). He is Editor-in-Chief of scientific Journal Strain (impact factor 2.2) and Dutch representative of the European Structural Integrity Society (ESIS).

- Visit the Hoefnagels group webpage

- view here Johan's resume

Affiliated with

Partners in (semi-)industry

  • Philips Research / Lighting / DAP
  • Tata
  • VDL
  • Océ
  • Holst Centrum
  • TNO
  • NXP
  • ASML
  • Ramlab
  • Cirrus Logic
  • Lumileds
  • Sabic
  • IMEC
  • M2i
  • and others

Expertise related to UN Sustainable Development Goals

In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):

  • SDG 3 - Good Health and Well-being
  • SDG 7 - Affordable and Clean Energy
  • SDG 12 - Responsible Consumption and Production
  • SDG 13 - Climate Action

Education/Academic qualification

"Vidi" fellowship; a personal grant, awarded by NWO, to finance the 5-year research project ‘Stretching the limits of Stretchable Electronics’ , NWO

Award Date: 1 May 2013

Top Reviewer 2011 Engineering Fracture Mechanics , Elsevier

Award Date: 1 Mar 2011

"Veni" fellowship; a personal grant, awarded by NWO, to finance the 3-year research project ‘Novel Routes Towards Interfacial Integrity in Stretchable Electronics’ , NWO

Award Date: 1 May 2008

"Rubicon" fellowship; a personal grant, awarded by the Netherlands organization of scientific research (NWO), to finance the 7-months working visit at Harvard University , NWO

Award Date: 1 Mar 2006

John Coburn & Harold Winters Student Award winner finalist for oral presentation at the 50th American Vacuum Society International Symposium, Baltimore, American Vacuum Society

Award Date: 1 May 2003

Dorothy Hoffman Travel Award, American Vacuum Society

Award Date: 1 May 2001

Scholarship for a 6-month traineeship at State University of New York (SUNY), Albany, New York, USA, State University of New York (SUNY)

Award Date: 1 May 1997

Scholarship for a 2-months traineeship at IMEC, Leuven , Eindhoven University of Technology

Award Date: 1 May 1997

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