• 1725 Citations

Research output per year

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Personal profile


“A sustainable society requires durable materials and material systems, in which the damage and failure mechanisms that act at the microscale are understood and controlled.”

Research profile

Johan Hoefnagels is an Associate Professor in the Eindhoven University of Technology (TU/e) group Mechanics of Materials at Mechanical Engineering, following his earlier background in applied plasma physics and advanced optical diagnostics. His current research focuses on experimental micromechanics of ‘thin films and interfaces’, by studying the systems’ micro-mechanics through integration of mechanical-microscopic characterization of underlying micro-mechanisms, such as damage and fracture, and integrate coupling of numerical simulations to experimental procedures. Topics of particular interest include delamination, ductile damage, size effects, flexible and stretchable electronics and MEMS. One of Johan’s research projects involves investigating a revolutionary mechanism to make electronics extremely stretchable and demonstrating this by means of an inflatable, in-vivo ultrasound detector, for which the first key step has been achieved: a free-standing interconnect has been designed that can be elastically stretched beyond 2000% and cyclically stretched at 1000% for over 10 million times.  

- Visit the Hoefnagels group page

Academic background

Johan Hoefnagels obtained his MSc and PhD in Applied Physics at TU/e, with a PhD thesis on advanced optical diagnostics of surface processes during thin film deposition. After his PhD he made a dramatic switch to become assistant professor in ‘experimental micromechanics’ at the department of mechanical engineering, where he later became associate professor in the same field. He leads the ‘Multi-Scale lab’ dedicated to ‘integrated mechanical testing’, which is one of TU/e’s 10 strategic labs.

Till 2018, Johan has (co-)authored >80 journal publications (of which ~50 times as corresponding author) and >100 refereed proceedings/book contributions. At international conferences, has given >100 presentations, of which around a third on invitation, and organized over 10 symposia. He has over two years of international research experience, built up during international visits to, amongst others, IMEC (Leuven, Belgium), SUNY (Albany, USA), NIST (Gaithersburg, USA), CSM (Golden, USA), and Harvard University (Cambridge, USA). He is Editor-in-Chief of scientific Journal Strain (impact factor 2.2) and Dutch representative of the European Structural Integrity Society (ESIS).

- view here Johan's resume

Affiliated with

Partners in (semi-)industry

  • Philips Research / Lighting / DAP
  • Tata
  • VDL
  • Océ
  • Holst Centrum
  • TNO
  • NXP
  • ASML
  • Ramlab
  • Cirrus Logic
  • Lumileds
  • Sabic
  • IMEC
  • M2i
  • and others

Education/Academic qualification





American Vacuum Society

American Vacuum Society

State University of New York (SUNY)

Eindhoven University of Technology

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Research Output

Demonstrating the potential of accurate absolute cross-grain stress and orientation correlation using electron backscatter diffraction

Vermeij, T., De Graef, M. & Hoefnagels, J., 15 Mar 2019, In : Scripta Materialia. 162, p. 266-271 6 p.

Research output: Contribution to journalArticleAcademicpeer-review

  • 8 Citations (Scopus)
    6 Downloads (Pure)

    Ferrite slip system activation investigated by uniaxial micro-tensile tests and simulations

    Du, C., Maresca, F., Geers, M. G. D. & Hoefnagels, J. P. M., 1 Mar 2018, In : Acta Materialia. 146, p. 314-327 14 p.

    Research output: Contribution to journalArticleAcademicpeer-review

  • 12 Citations (Scopus)
    2 Downloads (Pure)

    Retardation of plastic instability via damage-enabled micro-strain delocalization

    Hoefnagels, J. P. M., Tasan, C. C., Maresca, F., Peters, F. J. & Kouznetsova, V., 2015, In : Journal of Materials Science. 50, 21, p. 6682-6897 16 p.

    Research output: Contribution to journalArticleAcademicpeer-review

    Open Access
  • 13 Citations (Scopus)
    236 Downloads (Pure)

    Copper–rubber interface delamination in stretchable electronics

    Hoefnagels, J. P. M., Neggers, J., Timmermans, P. H. M., Sluis, van der, O. & Geers, M. G. D., 2010, In : Scripta Materialia. 63, 8, p. 875-878

    Research output: Contribution to journalArticleAcademicpeer-review

  • 29 Citations (Scopus)

    Processing induced size effects in plastic yielding upon miniaturisation

    Janssen, P. J. M., Hoefnagels, J. P. M., de Keijser, T. H. & Geers, M. G. D., 2008, In : Journal of the Mechanics and Physics of Solids. 56, 8, p. 2687-2706

    Research output: Contribution to journalArticleAcademicpeer-review

  • 25 Citations (Scopus)
    3 Downloads (Pure)


  • RUBICON personal grant

    Johan P.M. Hoefnagels (Recipient), 2005

    Prize: NWORubiconScientific

  • Top Reviewer 2011 Engineering Fracture Mechanics

    Johan P.M. Hoefnagels (Recipient), 2011

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific


    Press / Media

    Acta Journals’ Outstanding Reviewers in 2019

    Johan P.M. Hoefnagels & Nitish Singh


    1 item of Media coverage

    Press/Media: Expert Comment


    Theme 1: Damage and failure in advanced engineering materials

    Johan P.M. Hoefnagels (Researcher), Mirna van den Boomen (Administrative support)

    Impact: Research Topic/Theme (at group level)

    Theme 2: Miniaturisation and MEMS: Mechanical size effects, membranes and thin films

    Johan P.M. Hoefnagels (Researcher), Mirna van den Boomen (Administrative support)

    Impact: Research Topic/Theme (at group level)

    Theme 3: Mechanics of interfaces: Delamination and debonding

    Johan P.M. Hoefnagels (Researcher), Mirna van den Boomen (Administrative support)

    Impact: Research Topic/Theme (at group level)


    Theme 4: Flexible and stretchable electronics

    Johan P.M. Hoefnagels (Researcher), Mirna van den Boomen (Administrative support)

    Impact: Research Topic/Theme (at group level)

    Student theses

    An analytical-experimental approach for interface characterization using integrated DIC

    Author: Baan, M., 31 Jan 2015

    Supervisor: Hoefnagels, J. (Supervisor 1) & van der Sluis, O. (Supervisor 2)

    Student thesis: Master

    A novel pure bending test methodology for the investigation of mechanical failure behavior of flexible electronics

    Author: Ruybalid, A., 31 Mar 2013

    Supervisor: Hoefnagels, J. (Supervisor 1), Geers, M. (Supervisor 2), Bouten, P. C. (External person) (External coach) & van Breemen, L. (Supervisor 2)

    Student thesis: Master

    Cavity ringdown study of the densities and kinetics of SiHx radicals in a remote SiH4 plasma

    Author: Hoefnagels, J., 31 Aug 2000

    Supervisor: Kessels, W. (Supervisor 1), Boogaarts, M. G. (External person) (Supervisor 2), van de Sanden, M. (Supervisor 2) & Schram, D. (Supervisor 2)

    Student thesis: Master


    Characterization and modeling of interfacial adhesion for semiconductor applications covering the full range of mode mixity

    Author: Thijsse, J., 30 Jun 2006

    Supervisor: Geers, M. (Supervisor 1), van Dommelen, J. (Supervisor 2), Luijten, C. (Supervisor 2), Hoefnagels, J. (Supervisor 2), van der Sluis, O. (External coach) & van Driel, W. (External coach)

    Student thesis: Master