• 4159 Citations
1991 …2019

Research output per year

If you made any changes in Pure these will be visible here soon.

Personal profile

Research profile

Erik Jan Marinissen is Scientific Director at the world-renowned research institute imec in Leuven, Belgium, where he is responsible for research on test and design-for-test, covering topics as diverse as TSV-based 3D-stacked ICs, silicon photonics, CMOS technology nodes below 5nm, and STT-MRAMs. In addition, he is Visiting Researcher at Eindhoven University of Technology, the Netherlands. Previously, he worked at NXP Semiconductors and Philips Research Laboratories in Eindhoven. Marinissen holds an MSc degree in Computing Science (1990) and a PDEng degree in Software Technology (1992), both from Eindhoven University of Technology. He is co-author/editor of one book, author of chapters in six books, (co-)author of 270 journal and conference papers, and (co-) inventor on 18 granted US/EP patent families. Marinissen is recipient of the Most Significant Paper Awards at the IEEE International Test Conference (ITC) 2008 and 2010, Best Paper Awards at the Chrysler-Delco-Ford Automotive Electronics Reliability Workshop 1995, the IEEE International Board Test Workshop 2002, the International Wafer-Level Packaging Conference (IWLPC) 2018, the IEEE Latin-American Test Symposium (LATS) 2019, and the DATE 2020 Conference and Exhibition, the Most Inspirational Presentation Award at the IEEE Semiconductor Wafer Test Workshop 2013, the HiPEAC Tech Transfer Award 2015, the National Instruments’ Engineering Impact Award 2017, the IEEE Standards Association Emerging Technology Award 2017. He served as Editor-in-Chief of IEEE Std 1500 and as Founder and Chair (currently Vice-Chair) of the IEEE Std P1838 Working Group on 3D test access. Marinissen is founder of the workshops ‘Diagnostic Services in Network-on-Chips’ (DSNOC), DATE’s Friday 3D Integration, and the IEEE ‘International Workshop on Testing Three-Dimensional Integrated Circuits’ (3D-TEST). He has been Program Chair of DDECS 2002, ETS 2006, 3D-TEST 2009-15, and DATE 2013, and General Chair of ETW 2003, DSNOC 2007-08, 3DIW 2009-10, and serves on numerous conference committees, including ATS, DATE, ETS, ITC, ITC-Asia and VTS. He serves on the editorial boards of IEEE ‘Design & Test’ and Springer’s ‘Journal of Electronic Testing: Theory and Applications’. During the span of his career, Marinissen has supervised 43 international MSc and PhD students. He is a Fellow of IEEE (2011), Golden Core Member of IEEE Computer Society (2005), and elected as member of the Computer Society's Board of Governors (2019-2021).

External positions

Lecturer, High Tech Institute

2016 → …

Principal Scientist, IMEC

1 Oct 2008 → …

Senior Principal Scientist, NXP Semiconductors

1 Aug 200630 Sep 2008

Principal Scientist, Philips Research Laboratories

1 Mar 199231 Jul 2006

Fingerprint Dive into the research topics where Erik Jan Marinissen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output

3D design‐for‐test architecture

Marinissen, E. J., Konijnenburg, M., Verbree, J., Chi, C-C., Deutsch, S., Papameletis, C., Burgherr, T., Shibin, K., Keller, B. L., Chickermane, V. & Goel, S. K., 8 Feb 2019, Handbook of 3D integration: volume 4: design, test, and thermal management. Franzon, P. D., Marinissen, E. J. & Bakir, M. S. (eds.). Weinheim: Wiley-VCH Verlag, p. 253-280 28 p.

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

  • 3D test: no longer a bottleneck!

    Marinissen, E. J., 8 Mar 2019, In : 3DInCites: The First Decade. 1, 1, p. 21-26 + 60 7 p.

    Research output: Contribution to journalArticleProfessional

    Open Access
    File
  • 55 Downloads (Pure)

    Application of cell-aware test on an advanced 3nm CMOS technology library

    Gao, Z., Malagi, S., Hu, M. C., Swenton, J., Baert, R., Huisken, J., Chehab, B., Goossens, K. & Marinissen, E. J., Nov 2019, 2019 IEEE International Test Conference, ITC 2019. Piscataway: Institute of Electrical and Electronics Engineers, 6 p. 9000164

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

  • Cost modeling for 2.5D and 3D stacked ICs

    Taouil, M., Hamdioui, S. & Marinissen, E. J., 8 Feb 2019, Handbook of 3D integration: volume 4: design, test, and thermal management. Franzon, P. D., Marinissen, E. J. & Bakir, M. S. (eds.). Weinheim: Wiley-VCH Verlag, p. 189-208 20 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

  • Defect-location identification for cell-aware test

    Gao, Z., Malagi, S., Marinissen, E. J., Swenton, J., Huisken, J. & Goossens, K., 6 May 2019, LATS 2019 - 20th IEEE Latin American Test Symposium. Piscataway: Institute of Electrical and Electronics Engineers, 6 p. 8704561

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Open Access
  • 3 Citations (Scopus)

    Prizes

    Best 3D Track Paper at International Wafer-Level Packaging Conference 2018

    Arnita Podpod (Recipient), Dimitrios Velenis (Recipient), Alain Phommahaxay (Recipient), Pieter Bex (Recipient), Ferenc Fodor (Recipient), Erik Jan Marinissen (Recipient), Kenneth June Rebibis (Recipient), Andy Miller (Recipient), Gerald Beyer (Recipient) & Eric Beyne (Recipient), 25 Oct 2018

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

  • Best Paper Award Chrysler-Delco-Ford Automotive Electronics Reliability Workshop 1995

    Erik Jan Marinissen (Recipient), Oct 1995

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

  • Best Paper Award IEEE International Board Test Workshop (BTW'02)

    Erik Jan Marinissen (Recipient), Ben Bennetts (Recipient) & H.G.H. Vermeulen (Recipient), Oct 2002

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

    File
  • Best Paper Award IEEE Latin-American Test Symposium 2019

    Zhan Gao (Recipient), Santosh Malagi (Recipient), Erik Jan Marinissen (Recipient), Joe Swenton (Recipient), Jos Huisken (Recipient) & Kees Goossens (Recipient), 13 Mar 2019

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

    Best Paper Award International Wafer-Level Packaging Conference 2018

    Arnita Podpod (Recipient), Dimitrios Velenis (Recipient), Alain Phommahaxay (Recipient), Pieter Bex (Recipient), Ferenc Fodor (Recipient), Erik Jan Marinissen (Recipient), Kenneth June Rebibis (Recipient), Andy Miller (Recipient), Gerald Beyer (Recipient) & Eric Beyne (Recipient), 25 Oct 2018

    Prize: OtherCareer, activity or publication related prizes (lifetime, best paper, poster etc.)Scientific

  • Activities

    • 8 Workshop, seminar, course or exhibition
    • 3 Editorial activity
    • 2 Conference
    • 1 Membership of board

    IEEE Computer Society Board of Governors (External organisation)

    Erik Jan Marinissen (Member)
    1 Jan 201931 Dec 2021

    Activity: Membership typesMembership of boardProfessional

    File

    IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits

    Erik Jan Marinissen (Chair)
    8 Oct 20159 Oct 2015

    Activity: Participating in or organising an event typesWorkshop, seminar, course or exhibitionScientific

    IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits

    Erik Jan Marinissen (Chair)
    23 Oct 201424 Oct 2014

    Activity: Participating in or organising an event typesWorkshop, seminar, course or exhibitionScientific

    IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits

    Erik Jan Marinissen (Chair)
    12 Sep 201313 Sep 2013

    Activity: Participating in or organising an event typesWorkshop, seminar, course or exhibitionScientific

    16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013)

    Erik Jan Marinissen (Chair)
    18 Mar 201322 Mar 2013

    Activity: Participating in or organising an event typesConferenceScientific

    Press / Media

    Behind the Scenes of IEEE Std 1838™-2019

    Erik Jan Marinissen

    19/03/20

    1 item of Media coverage

    Press/Media: Expert Comment

    An Inside Look at 3D-DfT Standard IEEE Std 1838™-2019

    Erik Jan Marinissen

    17/03/20

    1 item of Media coverage

    Press/Media: Expert Comment

    Intel Joins CHIPS Alliance; 3D Stack Testing Standardized

    Erik Jan Marinissen

    3/03/20

    1 item of Media coverage

    Press/Media: Expert Comment

    Stacked dies to connect with test equipment

    Erik Jan Marinissen

    3/02/20

    1 item of Media coverage

    Press/Media: Expert Comment

    Student theses

    Automated test control block generation and minimization

    Author: Marinissen, E., 14 Mar 1990

    Supervisor: Rem, M. (Supervisor 1), Dekker, R. (External person) (Supervisor 2) & Beenker, F. (Supervisor 2)

    Student thesis: Master

    Automatic generation of in-circuit tests on Prodrive's AET system for board assembly defects

    Author: van Schaaijk, H., 31 Aug 2017

    Supervisor: Mesman, B. (Supervisor 1), Marinissen, E. (Supervisor 2), Alvarado, A. (Supervisor 2) & Spierings, M. G. (External coach)

    Student thesis: Master

    File

    LaySiChain: the improved layout-sensitive scan chain inserter

    Author: van den Heuvel, P., 30 Jun 1997

    Supervisor: Segers, M. (Supervisor 1) & Marinissen, E. J. (External coach)

    Student thesis: Master

    File

    Reducing IC test time through parallel composition of test protocols

    Author: Moerenhout, M., 31 Aug 1996

    Supervisor: Aarts, E. (Supervisor 1) & Marinissen, E. (Supervisor 2)

    Student thesis: Master

    SmartScan: full scan benefits for partial scan cost

    Author: Verhaegh, J., 31 Oct 1994

    Supervisor: Segers, M. (Supervisor 1), Merkus, P. (Supervisor 2) & Marinissen, E. J. (External coach)

    Student thesis: Master

    File