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Arezou Meighan, MSc

  • 0 Citations
20172019
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  • 2 Similar Profiles
Wafer bonding Engineering & Materials Science
Photonics Engineering & Materials Science
Adhesion Engineering & Materials Science
Metals Engineering & Materials Science
Permittivity Engineering & Materials Science
Polymers Engineering & Materials Science
Industry Engineering & Materials Science

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Research Output 2017 2019

  • 2 Conference contribution

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Zhang, X., Liu, X., Spiegelberg, M., Meighan, A., van der Tol, J. J. G. M. & Matters-Kammerer, M. K., 14 Jan 2019, 2018 18th Mediterranean Microwave Symposium, MMS 2018. IEEE Computer Society, p. 112-115 4 p. 8611895

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Pulse amplitude modulation
Light modulators
Photonics
Packaging
Polymers

Low resistance metal interconnection for direct wafer bonding of electronic to photonic ICs

Meighan, A., Wale, M. J., de Vries, T., Smalbrugge, E. & Williams, K. A., 2017, Proceedings of the 22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 27-28, 2017, Delft, Netherlands. p. 1-4

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Wafer bonding
Photonics
Adhesion
Metals
Permittivity