• P.O.Box 513, Department of Electical Engineering

    5600 Eindhoven

    Netherlands

Organization profile

Introduction / mission

The mission of the research on emerging technologies and applications is to design circuits and systems which exploit novel device technologies, in order to expand the application domain of electronics beyond what is conventionally possible with silicon integrated circuits (ICs) alone.

Organisational profile

In the last decade, silicon electronics has been increasingly integrated with other technologies (e.g. power devices, images sensors, MEMs) to enable new applications in the domains of physical and chemical sensing, healthcare, automotive, lighting, etc. The name ‘More than Moore’ has been used for these developments. The most long-term research in More than Moore’s electronics strives to integrate silicon with emerging non-silicon technologies like large-area, flexible, conformable, printed and nano-material based electronics to enable completely new applications.

The domain of emerging technologies is extremely broad, and research in the use of emerging technologies for electronic application needs focus. The IC group has decided to concentrate the research on circuit design for emerging technologies in two research programs:

1. Flexible and printed electronics
Integrated silicon electronics consists of in tiny and rigid ‘chips’. For this reason it cannot serve all purposes. Large-area electronics has been invented for applications like flat-panel displays, where transistors must cover large surfaces. Interestingly, some technologies for large area electronics keep the processing temperature always below 200°C, enabling the use of cheap plastic films as substrates and making possible flexible large-area circuits. Further research is focusing on the use of printing methods to fabricate this ‘flexible electronics’, achieving higher-speed production and even lower costs.
Flexible and printed large-area electronics, for its characteristics vastly different from silicon ICs, is an ideal candidate for our work towards enabling new applications of electronics. The characteristics of large-area, flexibility and low cost can be conveniently combined for different purposes, e.g. large area sensing surfaces, sensors integrated in packaging materials and flexible displays.

2. Integration of 2D nano-materials on Silicon ICs
Another set of emerging technologies which appears extremely promising from the circuit and system design perspective is the integration of 2D nano-material layers in the backend of line of Silicon ICs. Transistors, diodes and other devices exploiting such 2D molecular semiconductor layers have the potential to create ultra-sensitive detectors of e.g. charge and terahertz radiation on the surface of mainstream ICs.

Fingerprint Dive into the research topics where Emerging Technologies is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.

Thin film transistors Engineering & Materials Science
Networks (circuits) Engineering & Materials Science
Metal foil Engineering & Materials Science
Capacitors Engineering & Materials Science
Sensors Engineering & Materials Science
Electronic equipment Engineering & Materials Science
Transistors Engineering & Materials Science
Radio frequency identification (RFID) Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 2008 2019

1 Downloads (Pure)

A 0.34-571nW all-dynamic versatile sensor interface for temperature, capacitance, and resistance sensing

Xin, H., Andraud, M., Baltus, P. G. M., Cantatore, E. & Harpe, P. J. A., Sep 2019, ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference. Piscataway: Institute of Electrical and Electronics Engineers, p. 161-164 4 p. 8902918

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Capacitance
Sensors
Electric power utilization
Capacitive sensors
Temperature
13 Downloads (Pure)

A -81.6dBm sensitivity ultrasound transceiver in 65nm CMOS for symmetrical data-links

Berkol, G., Baltus, P. G. M., Harpe, P. J. A. & Cantatore, E., Sep 2019, ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference. PIscataway: Institute of Electrical and Electronics Engineers, p. 145-148 4 p. 8902921

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Open Access
File
data links
transmitter receivers
Transceivers
Transmitters
CMOS

A low power time domain ECG interface based on flexible a-IGZO TFTs

Zulqarnain, M., Stanzione, S., van der Steen, J. L. P. J., Gelinck, G. H., Myny, K. & Cantatore, E., 1 Jun 2019, Proceedings - 2019 8th International Workshop on Advances in Sensors and Interfaces, IWASI 2019. Piscataway: Institute of Electrical and Electronics Engineers, p. 205-209 5 p. 8791321

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Electrocardiography
Time Domain
preamplifiers
pulse duration
Low-frequency Noise

Activities 2017 2017

  • 2 Keynote talk

Circuit design of large-area sensors on foil

Eugenio Cantatore (Invited speaker), S. Abdinia (Speaker), M. Fattori (Speaker), J.A. Fijn (Speaker), C. Garripoli (Speaker), M. Mohammad Zulqarnain (Speaker)
8 Nov 2017

Activity: Talk or presentation typesKeynote talkScientific

Biopotential interfaces based on large-area flexible electronics

Eugenio Cantatore (Keynote speaker), S. Abdinia (Speaker), C. Garripoli (Speaker), M. Mohammad Zulqarnain (Speaker)
27 Oct 2017

Activity: Talk or presentation typesKeynote talkScientific

Press / Media

Researchers develop new electronic packaging to lower food waste

Eugenio Cantatore

28/02/13

1 item of Media coverage

Press/Media: Expert Comment

Researchers create new sensor circuit to test food packaging

Eugenio Cantatore

28/02/13

1 item of Media coverage

Press/Media: Expert Comment

New device could eliminate food wastage worldwide

Eugenio Cantatore

28/02/13

1 item of Media coverage

Press/Media: Expert Comment